溶融塩電析によるNiシリサイド膜の作製とその高温耐食性
1998 年 49 巻 5 号 p. 507-513
詳細
1998 年 49 巻 5 号 p. 507-513
A Ni suicide layer on Ni substrate was formed by electrodepositing Si and alloying it with Ni in molten salt. Electrolysis was conducted using potentiostatic polarization at constant potentials in an equimolar NaCl-KCl melt containing 5mol% K2SiF6 at 1023K. The maximum mass of electrodeposited material was obtained at -1.3V (vs. Ag/Ag+(0.1)). Deposits formed at -1.2 to -1.5V were conical or cylindrical surface crystals and film-like material beneath crystals. Such deposits consist of Ni silicides such as α-NiSi2, NiSi and ε-Ni3Si2. Si content in deposits decreased with increasing depth from the surface to the deposit/substrate interface. Nickel covered by the electrodeposit was more resistant than bare nickel to hot corrosion by molten Na2SO4.
