表面技術
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
流動層中でのニッケルのホウ化処理
上田 順弘曽根 匠水越 朋之池永 明川本 信
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1999 年 50 巻 3 号 p. 282-288

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Bonding is useful in surface hardening nickel (Ni) in many surface treatments. Although Ni boronized by powder-pack bonding with amorphous boron and by gas bonding with BCl3 has been reported, few reports cover bonding in a fluidized bed. We analyzed the treated layer using X-ray diffraction (XRD), glancing incidence X-ray diffraction, glow discharge emission spectrometry (GDS), and electron probe microanalyzer (EPMA). High-temperature microhardness and friction and wear characteristics of boronized Ni were studied, with the following results:
(1) Bonding Ni at a high temperature over a long time in a fluidized bed showed flaking of the treated layer due to Ni siliconization.
(2) The Knoop hardness was 1300HK for the sample boronized 7.2ks at 1073K. The boride layer was about 25μm thick and consisted mainly of Ni2B and Ni3B.
(3) The high-temperature microhardness of boronized Ni is higher than that of untreated Ni below about 800K.
(4) Friction properties and wear resistance to SUJ2 and SUS304 were improved by Ni bonding.
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