An electroless nickel plating bath with a hydrazine reducing agent has been investigated. An electroless nickel plating bath with a deposition rate of about 3μm/hr and superior bath stability as compared to previously reported bath has been developed. The new bath is a simple system consisting of glycine and boric acid in addition to nickel and hydrazine. The optimum plating conditions for the bath are in the range of 85-90°C at a pH of 12. The deposits obtained from the developed bath are black with a surface morphology that has a dendrite structure. Characteristics of deposits such as specific resistance and solderability were superior to those of conventional nickel-phosphorus deposits. Results confirmed that nickel was directly deposited on a copper substrate from an electroless nickel plating bath with a hydrazine reducing agent without an activation step in pretreatment.