2001 年 52 巻 3 号 p. 289-293
Electroless nickel plating is not initiated on the copper substrate since there is little catalytic action with respect to the oxidation reaction of sodium hypophosphite on the copper. Therefore, a palladium catalyst treatment is generally applied. However, the extraneous deposition of nickel on the resist or resin is often observed as a result of treatment with the palladium catalyst along with the shrinking of patterns.
This research involved improving the selective deposition through the use of Dimethyl Amine Borane (DMAB) instead of the palladium catalyst. Selective deposition has improved with the addition of DMAB to the electroless nickel plating bath as a second reducing agent.
The mechanism of the selective deposition on the copper through the use of DMAB in electroless nickel plating has been explained in this study.