Ni-P無電解めっきにおけるPdに代わる活性化剤としての水酸化物コロイドの応用

抄録

A colloidal hydroxide solution consisted of nickel sulfate, copper sulfate, and tartaric acid was prepared as a substitute for a palladium catalyst in nickel-phosphorus electroless plating. The colloids were adsorbed on an ABS resin substrate and then reduced chemically to produce activated sites for electroless plating. After nickel-phosphorus electroless plating, the articles were used for the evaluation of the 90°peeling strength and of the initial covering velocity with the nickel-phosphorus film during the electroless plating. Results indicated the following.
(1) An ABS resin substrate treated with the colloidal solution yielded an adhesion strength for the plating film as strong as one activated by a conventional coupling of tin (2+) ions as sensitizer and palladium (2+) ions as activator for the electroless plating. The ABS resin substrate, in particulars activated using a colloidal solution of pH 7.8 consisting of 0.08mol/dm³ nickel sulfate, 0.01mol/dm³ copper sulfate and 0.04mol/dm³ tartaric acid, caused cohesive-destruction with the plated nickel-phosphorus film during the 90°peeling strength test.
(2) Both copper ions and copper hydroxide in the colloidal solutions served to reduce the time for the ABS resin substrate to be covered uniformly by the nickel-phosphorus film during electroless plating. However, they tended to enhance the surface roughness.