Journal of the Japan Society of Colour Material
Online ISSN : 1883-2199
Print ISSN : 0010-180X
ISSN-L : 0010-180X
Original Research Paper
Copper Plating on Corona Treated Fluororubber Surfaces Using a Molecular Adhesive Technology
Hidetoshi HIRAHARATakahiro KUDOKatsuhito MORIYusuke MATSUNOKunio MORI
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JOURNAL FREE ACCESS

2013 Volume 86 Issue 9 Pages 321-324

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Abstract

The copper plating of the fluororubber (FKM ; fluororubber (vinylidene fluoride- hexafluoropropylene copolymer) has been investigated using 6-(3-triethoxysilylpropylamino)-1,3,5-triazine-2,4-dithiol monosodiumsalt (TES) as a molecular adhesive agent. Corona discharge treatment under different conditions to give an OH group was carried out for FKM surfaces in air, and were treated readily with the TES aqueous solution and ethanol. The FKM treated TES was used to provide a surface-coupled layer of functional molecules, to assist in the adsorption of Pd/Sn catalysts and the subsequent electroless copper plating and electro copper plating. The structure and chemical changes of FKM surfaces were analyzed with the contact angle of water, atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS). The surface energy of the FKM was increased by corona discharge treatment times, and the oxygen atom was introduced to the FKM. The amount of TES on FKM surfaces increased with increasing corona discharge treatment times. The FKM treated TES / copper foil adhered products obtained, gave a very high peel strength of 5 kN/m, as well as rubber layer fracture in a peel test.

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© 2013 Japan Society of Colour Material
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