2006 年 47 巻 549 号 p. 958-962
Micro/nano-imprinting or micro/nano-hot embossing is a target of interest for the industrial production of micro and nano-devices. In fluidic micro electro mechanical system (MEMS) applications, polymer materials have been employed for the fabrication of low-cost products. However, glass is much more suitable for high-temperature applications and adverse chemical environments. Also, in optical MEMS glass is a good candidate material with which to achieve good optical properties. Si or Ni molds, usually employed for polymer forming, can no longer be used for glass forming owing to their poor heat resistance and the difficulty in removing them arising from the cohesion between the mold and glass. Glassy carbon (GC) is therefore a suitable material for high-temperature embossing. In this study, focused ion beam (FIB) machining was employed for the micro/nano-3D structuring of GC materials. The machining features of these materials are summarized as follows; 1) Nanomachining at a 0.5 μm resolution was possible. 2) A smooth surface with a maximum roughness of up to Ra 27 nm was formed after 22 μm depth machining. 3) Implanted Ga ions precipitated at 350°C annealing but disappeared after annealing in vacuum at an a high elevated temperature (1400°C). Finally, a quartz glass embossed structure was successfully fabricated by hot embossing with a high fidelity of 10x10x5 μm, a 0.5 μm line-and-space pattern and a 0.4 μm depth.