Tetsu-to-Hagane
Online ISSN : 1883-2954
Print ISSN : 0021-1575
ISSN-L : 0021-1575
Diffusion Barrier Effect of TiC Layer Formed at the Bonding Interface and Bonding Characteristics of an Explosively Welded Ti/SUS420J1 Stainless Steel Clad by Heat Treatment
Akira CHIBAMinoru NISHIDAYasuhiro MORIZONOKihatirou IMAMURA
Author information
JOURNAL FREE ACCESS

1997 Volume 83 Issue 11 Pages 736-741

Details
Abstract

The high temperature stability of an explosively welded Ti/SUS420J1 stainless steel clad was assessed by studying microstructures and bonding strengths of the clads with changing the annealing temperature. Compounds formed at their bonding interfaces consisted of TiC, FeTi, and/or Fe2Ti phases depending on the annealing conditions. The TiC layer formed at the boundary acts as an barrier for the diffusion of the base metals across the bonding interface under the 1000°C annealing and prevents the growth of intermetallic compounds, (FeTi and Fe2Ti) and of β-Ti. The specimens formed TiC layer at the bonding interface sustained high bonding strength even by high temperature annealing. Diffusion barrier effect diminished above 1050°C annealing due to the dissolution of TiC layer in γ matrix and the strength decreased. The diffusion barrier effect of the TiC layer was discussed on the basis of phase diagrams and physical properties of TiC compound.

Content from these authors
© The Iron and Steel Institute of Japan
Previous article Next article
feedback
Top