2004 Volume 4 Issue 4-2 Pages 235-240
We developed nanometer-order fabrication for 3-dimensional (3D) imprint molds, using acceleration-voltage-modulation electron beam (EB) direct writing. The inorganic EB resist was spin-on-glass (SOG), whose depth was controlled by changing the EB acceleration voltage. After EB exposure, the sample was developed using buffered hydrofluoric acid. The fabricated pattern depths on SOG were well gradated, and the depth resolution was 20 nm per 100V. The width resolution was 40 nm on SOG using an electron beam with a diameter of a few nanometers. Patterns were transferred by pressing the fabricated 3D SOG mold to a photo-curable resin under a pressure of 0.5 MPa and curing it with a 1 J/cm2 ultraviolet dose. Replicated patterns showed faithful, defect-free multigradation. Using SOG as the material for an ion beam etching mask, 3D molds were fabricated from diamond, engineering plastic, and quartz.
