A Novel 3D Power Divider Based on Half-Mode Substrate Integrated Circular Cavity

Abstract

A new kind of 3D power divider based on a half-mode substrate integrated circular cavity (HSICC) is proposed. This novel power divider can reduce the size of a power divider based on normal substrate integrated circular cavity (SICC) by nearly a half. To verify the validity of the design method, a two-way X-band HSICC power divider using low temperature co-fired ceramic (LTCC) technology is designed, fabricated and measured.