抄録
In this paper, a novel multilayer substrate integrated waveguide (SIW) four-way out-of-phase power divider is proposed. It is realized by 3D mode coupling, on multilayer substrates. The structure consists of vertical Y-junction, lateral T-junction of SIW and lateral Y-junction of half-mode SIW. The advantages of the proposed structure are its low cost and ease of fabrication. Also, it can be integrated easily with other planar circuits such as microstrip circuits. An experimental circuit is designed and fabricated using the traditional printed circuit board technology. The simulated and measured results show that the return loss of the input port is above 15 dB over 8 to 11.8 GHz and transmissions are about -7.6±1.6 dB in the passband. It is expected that the proposed the proposed power divider will play an important role in the future integration of compact multilayer SIW circuits and systems.
