日本機械学会論文集
Online ISSN : 2187-9761
ISSN-L : 2187-9761
熱工学,内燃機関,動力エネルギーシステム
沸騰冷却を用いた高密度実装ICTラック用冷却装置(低背型熱サイフォンの基本性能評価)
藤本 貴行武田 文夫近藤 義広藤居 達郎加藤 猛
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2014 年 80 巻 815 号 p. TEP0202

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We have developed the cooling unit for high-density packaging ICT racks by using the boiling heat transfer with the concept of transporting a heat generated from CPU into the outdoor atmosphere directly without exposure to air in the computer room. The aim of this paper is to evaluate the cooling and power saving performance of the cooling unit using the low height type thermosyhon installed in the 1U server and the heat exchanger cooled by the water from the outdoor chiller unit. First, we clarified some factors (tilt angle, flow passage length and cross sectional area of thermosyhon) influencing the cooling performance. Then we examined the power saving performance of this cooling system during operating 32 CPUs in the ICT rack and compared to the conventional system using the computer room air conditioner.

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© 2014 一般社団法人日本機械学会
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