Development of epoxy resin polishing pads with the addition of polymer particles

Abstract

Polishing processes are critical to high material removal rate and excellent surface roughness. To realize the highly-efficient polishing of glassware, which are used as materials for flat-panel displays, glass lens, substrates of magnetic disks, a new-type polishing pad composited with an epoxy resin and polymer particles was developed, in this study. Authors focused on a surface asperity of the polishing pad for improving the abrasive retention capability of polishing pads and the slurry invasive activity to the polishing area. For changing the hydrophilic property of polishing pads, various type polymer particles were added to the epoxy resin. The hydrophilic polymer particles can improve the polishing characteristics of a normal epoxy resin pad. Because wear rates of the polymer particles and the epoxy resin, a rough surface of the polishing pad generals in polishing process. The rough surface advances the slurry invasive activity. The polymer particles assist the epoxy resin to grip the abrasives on the polishing pad. The material removal rate increases with increasing in the grain size and the hardness of the polymer particles added in the polishing pad. The addition amount of the particles and the hardness of epoxy resin affect the polishing characteristics of the polishing pads. The perfect addition amount and the hardness of epoxy resin were discussed.