1996 年 1996 巻 41 号 p. 53-64
Standardization of characterization methods of mechanical properties of thin plates and fine wires is reported. These plates and wires are used for electronics equipment in the variety of fields such as information, telecommunication, office automation, automatic control or transportation.
Variety of mechanical properties of thin plates and fine wires were investigated in the antecedents of the research committee for electronic materials & components, the committee on strength of flat spring and the committee for characterization of spring materials in electronic use. Among these characteristics, most fundamental tests of hardness test, tensile test and fatigue test are reported. Especially, common testing methods for thin plates with less than 0.2mm thickness and fine wires with less than 0.2mm diameter are reported to propose standardization of testing method to be authorized by Japan springs manufacture's association.