マルチチップ完全密着型イメージセンサ : 情報入力

抄録

Two new-type flip-chip semiconducter bonding methods and two new-type optical substrates have been developed. In addition, two new-type multi-chip direct contact-type image sensors have been developed, using the above bonding methods and optical substrates, for graphic image scanners used in office equipment such as high-speed facsimiles, intelligent photo-copy equipment and computers.