Vacuum and Surface Science
Online ISSN : 2433-5843
Print ISSN : 2433-5835
Special Feature : Progress and Prospect of Semiconductor Integrated Circuit Technology by 3D Stacked Integrated Device
Introduction of Bonding Technologies for 3D Integrations
Masahisa FUJINO
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2019 Volume 62 Issue 11 Pages 672-675

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Abstract

3D integration is one of the most important technologies for developing new-generation electronics devices.

In this article, bonding technologies, key factor of 3D integration are introduced. In particular, fusion bonding method and direct bonding method have the potential for wafer level bonding.

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この記事はクリエイティブ・コモンズ [表示 - 非営利 4.0 国際]ライセンスの下に提供されています。
https://creativecommons.org/licenses/by-nc/4.0/deed.ja
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