2019 年 62 巻 7 号 p. 433-438
We have succeeded in the formation of SiO2 and Al2O3 films at room temperature using a large amount of chemically active species produced after mixing high purity ozone gas and ethylene gas (OER) to be utilized in chemical vapor deposition process (OER-CVD) and atomic layer deposition process (OER-ALD), respectively. Although a SiO2 film was formed by OER-CVD at room temperature, it showed comparable characteristics to that conventionally formed at high temperature. The OER-CVD and the OER-ALD are expected to enable various kinds of oxide film deposition (e.g., TiO2, ZnO) at lower temperature.