特集「Beyond5G実現に向けた要素技術の開発」
異種材料接合技術を利用したハイブリッド光集積回路
2022 年 65 巻 6 号 p. 264-269
詳細
2022 年 65 巻 6 号 p. 264-269
Toward realization of ultra-high-speed and low-power-consumption photonic transceiver, heterogeneous integration technology and photonic devices using the technology is reviewed. First, the reason why the heterogeneous integration technology should be needed is explained. Next, bonding technology, fabrication process and characteristics of hybrid photonic devices are explained.
