Light-emitting diodes （LEDs） have advantages in small size, light weight and, energy saving. They are usedfor portable device, backlight sources for TVs, light sources for illumination by practical application of white LEDs. Polyamide （PA） resin molding compounds are mainly used from the viewpoint of initial reflectivityand mechanical toughness for the LED reflectors. However, there is a problem that the light emissionintensity and luminance of the LED are lowered. The reason may be discoloration of PA in the reflector dueto heat and light, discoloration of impurities and low molecular weight oligomers in the resins, oxidation ofadditives （antioxidant, plasticizer, oligomer, etc.） by heat and light. PA resins are unavoidable in the formationof pyrrole ring compounds in thermal degradation （in the presence of oxygen ） and in the formation ofcompounds having aldehyde and amino groups in photodegradation. It is known that they form conjugateddouble bonds to absorb visible light, resulting in color change. It is said that PA resins containing amide grouphave fundamental issue, because higher heat resistance and light resistance are emphasized by increasing thebrightness of LEDs in the future.Therefore, we focus on thermosetting polyester （UP）, which is characterized by （Ⅰ） free from amidegroup, （Ⅱ） achievement with outdoor paint, （Ⅲ）high degree of freedom of combining polyhydric alcoholand polybasic acid. We have developed UP molding compounds having high reflectivity and high whiteness.We have reported that the light fastness of materials is improved by incorporating cyclohexyl ring into thebackbone of UP. In this manuscript, we report on the modeling of light source distance dependency of materialdeterioration, trial for manufacturing and evaluation of small actual model package, which is the current trendusing the developed UP materials.The developed UP molding materials have found overwhelming performance and high reliability byevaluation of side view type PKG compared with PA molding materials.

アミド系熱可塑性エラストマーのための簡便で迅速なハードセグメントの構築手法，これを用いたブロック共重合体の合成と物性について述べた。ハードセグメントの構築法としては，塩化チオニルを用いるinsitu カルボキシ基の活性化・ビルディングブロックであるN 置換アミノ安息香酸との縮合反応を逐次的に行うことで，分子量分布1.03 の単分散分子を合成した。これとポリエーテルとの縮合重合を行うことで，マルチブロック共重合体を合成し，熱分析，広角X 線解析，偏光顕微鏡観察，AFM 観察により，ポリマーフィルム内の相分離挙動とフィルムの物性との相関を研究した。

構造用アクリル系接着剤は，常温で硬化し，多少の油面でも接着可能なことから，注目されている。これらの接着剤を構造物の接着に広く使用するためには，それらの接着剤に接着構造物の強度を予測するための手法を明確にする必要がある。本研究では，アクリル接着剤により接着された重ね合せ接着継手の静的強度を結合力に基づいて推定した。まず，本接着剤で接着されたArcan 型接着継手を用いて，モード1 および2 の荷重下でのアクリル接着剤のcohesive law を，接着層に垂直および接線方向のJ 積分およびき裂先端部の変位を同時に記録することによって求めた。次に，この接着剤により接着された単純重ね合せ接着継手の引張せん断試験を行い，実験的に求められたcohesive law を台形に単純化し，それを用いて有限要素法ソフトABAQUS，ANSYS による継手強度を推定した。その結果，実験よる得られた継手強度は，推定値とよく一致した。

There are various methods for imaging analysis using electromagnetic waves. Among them, imaging analysis by mid-infrared spectroscopy can simultaneously analyze the molecular structure of polymer. This chapter gives an outline of the mid-infrared imaging analysis method and measurement examples. The mid-infrared imaging method can analyze the structure of macromolecules as a two-dimensional distribution. We explain that the IR-imaging analysis technique is also excellent as an analytical technique of polymer adhesive interface.