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Hideo Kikuchi
Session ID: 5A-01
Published: 2014
Released on J-STAGE: July 27, 2018
CONFERENCE PROCEEDINGS
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Junichi Tanida, Masato Kaneko, Tatsuya Nishi, Shogo Tada, Minami Takat ...
Session ID: 5A-02
Published: 2014
Released on J-STAGE: July 27, 2018
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Kohei HORIGOME, Fukuro KOSHIJI, Kohji KOSHIJI
Session ID: 5A-03
Published: 2014
Released on J-STAGE: July 27, 2018
CONFERENCE PROCEEDINGS
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Kazuya HIRAGURI, Fukuro KOSHIJI, Koji KOSHIJI
Session ID: 5A-04
Published: 2014
Released on J-STAGE: July 27, 2018
CONFERENCE PROCEEDINGS
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Eri SAKURAI, Yusuke AKIYAMA, Fukuro KOSHIJI, Kohji KOSHIJI
Session ID: 5A-05
Published: 2014
Released on J-STAGE: July 27, 2018
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Kouji Tanaka, Kohei Ogasawara, Toshiyuki Maeyama
Session ID: 5A-06
Published: 2014
Released on J-STAGE: July 27, 2018
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In recent years, in small form factor devices such as smart phones,the size of the ground is limited.In particular, the ground isrequired for the radiation of the antenna.If not take the ground area,it is impossible to fully use the capacity of the antenna.We study thecase of mounting the antenna on the mounting circuit paper.
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Daisuke Momose, Takahiko Yamamoto, Kouji Koshiji
Session ID: 5A-07
Published: 2014
Released on J-STAGE: July 27, 2018
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Yusuke AKIYAMA, Fukuro KOSHIJI, Kohji KOSHIJI
Session ID: 5A-08
Published: 2014
Released on J-STAGE: July 27, 2018
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Mana Komatsu, Takahiko Yamamoto, Kohji Koshiji
Session ID: 5A-09
Published: 2014
Released on J-STAGE: July 27, 2018
CONFERENCE PROCEEDINGS
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Michio Tamate
Session ID: 5A-10
Published: 2014
Released on J-STAGE: July 27, 2018
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Yoshihide Murakami, Hiroshi Tanaka, Masahiko Kawaguchi
Session ID: 5A-11
Published: 2014
Released on J-STAGE: July 27, 2018
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Yoshitaka Toyota, Kengo Iokibe, Koichi Kondo, Shigeyoshi Yoshida, Tosh ...
Session ID: 5A-12
Published: 2014
Released on J-STAGE: July 27, 2018
CONFERENCE PROCEEDINGS
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Hiroyasu Sano, Toshinori Yamashita, Akihiro Tokikawa
Session ID: 5A-13
Published: 2014
Released on J-STAGE: July 27, 2018
CONFERENCE PROCEEDINGS
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Akihiro Tanaka, Tanahide Nozaki, Hideyuki Nananshi
Session ID: 5A-14
Published: 2014
Released on J-STAGE: July 27, 2018
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Takuro Murakami, Yuichi Mabuchi, Tohlu Matsushima, Takashi Hisakado, O ...
Session ID: 5A-15
Published: 2014
Released on J-STAGE: July 27, 2018
CONFERENCE PROCEEDINGS
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Hiroaki Matsuura, Yukio Tani, Takehiro Takahashi, Noboru Shibuya
Session ID: 5A-16
Published: 2014
Released on J-STAGE: July 27, 2018
CONFERENCE PROCEEDINGS
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Yosuke Watanabe, Takeshi Uchida, Yuichi Sasaki, Naoto Oka, Hideyuki Oh ...
Session ID: 5A-17
Published: 2014
Released on J-STAGE: July 27, 2018
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Recently, the application field of a high-speed differential transmission system has expanded, and a shielded twisted pair (STP) cable is used to improve noise immunity. But it is necessary to consider the grounding of shield sheath in STP cable. In this report, we focused on the pigtail grounding in STP cable. And evaluated the relationship between noise immunity and shield ground connection pigtail of STP cable, experimentally.
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Kouhei Otsuka, Noboru Shibuya, Takehiro Takahashi, Yukio Tani
Session ID: 5A-18
Published: 2014
Released on J-STAGE: July 27, 2018
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Kengo Iokibe, Kazuhiro Maeshima, Tetsushi Watanabe, Hiroto Kagotani, Y ...
Session ID: 5A-19
Published: 2014
Released on J-STAGE: July 27, 2018
CONFERENCE PROCEEDINGS
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Taiki Ibe, Tatsunori Takagi, Naoya Oikawa, Hiroyuki Ito, Yasunori Ogur ...
Session ID: 5A-20
Published: 2014
Released on J-STAGE: July 27, 2018
CONFERENCE PROCEEDINGS
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Tomoyuki Akahoshi, Daisuke Mizutani, Motoaki Tani, Kenichirou Abe, Syu ...
Session ID: 5B-01
Published: 2014
Released on J-STAGE: July 27, 2018
CONFERENCE PROCEEDINGS
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Masahiko Katayama, Sachio Yoshihara, Syozo Seino, Kimizuka Ryoichi
Session ID: 5B-02
Published: 2014
Released on J-STAGE: July 27, 2018
CONFERENCE PROCEEDINGS
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In recent years, via holes is used for the connection of external wiring and internal wiring of the multilayer substrate. When copper foil of wiring layer was processed by laser, melted copper was adhered, so projections called “overhang” are formed around the opening of via hole. Adhesiveness and flatness of plating will be decreased by the overhung, therefore removal process of them will be indispensable. Therefore magnetic polishing method was tried as a novel removal technique in this study.
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Tadahiro Yokozawa, Toru Miura, Satoshi Yoshino, Nobuhiro Harada
Session ID: 5B-03
Published: 2014
Released on J-STAGE: July 27, 2018
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Daigo Suzuki, Fongru Lin, Akihiko Happoya, Manabu Miyawaki, Kouichi Ka ...
Session ID: 5B-04
Published: 2014
Released on J-STAGE: July 27, 2018
CONFERENCE PROCEEDINGS
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Duksil Kim
Session ID: 5B-05
Published: 2014
Released on J-STAGE: July 27, 2018
CONFERENCE PROCEEDINGS
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Ichiro Koiwa, Nobuaki Watanabe, Syoma Koike, Norio Hirashita, Makoto U ...
Session ID: 5B-06
Published: 2014
Released on J-STAGE: July 27, 2018
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Cyanide was detected from the plated film which was plated from cyanide free bath. The cyanide was synthesized in the bath. In some cases, the cyanide was also detected from an activated carbon after activated charcoal treatment. The charcoal treatment also worked to eliminate the cyanide. The cyanide is easily synthesized under the condition with supply of nitrogen and carbon atoms. For example, a representative nickel electroplating bath, Watts bath with glycine and ammonium sulfate, the cyanide was also detected. Caution of cyanide synthesis is necessary and we should carefully treated platting baths which contain compound nitrogen atoms source such as ammonium and carbon atom source such as hydrocarbon. We should also carefully treated disposal of activated carbon after activated charcoal treatment, because they might contain cyanide.
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Natsuki Takahashi, Tsugito Yamashita
Session ID: 5B-07
Published: 2014
Released on J-STAGE: July 27, 2018
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Hiroki Horibe, Tomoyuki Habu, Shintaro Yabu, Kenichi Hirose, Makoto Wa ...
Session ID: 5B-08
Published: 2014
Released on J-STAGE: July 27, 2018
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Satoshi Oya, Yukari Ono, Hiroyuki Saitou, kouta Onodera
Session ID: 5B-09
Published: 2014
Released on J-STAGE: July 27, 2018
CONFERENCE PROCEEDINGS
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We investigated the wire bonding reliability and the solder joint reliability of the electroless Ni/Pd/Au plating for semiconductor package substrate. The wire bonding reliability and the solder joint reliability decreased with decrease of the film thickness of electroless Ni plating. In order to solve these problems, we developed the ultra thin electroless Ni/Pd/Au process for fine-pitch design.
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Takuya Kobayashi, Kazunori Kano, Toshihiro Suzuki, Atsushi Kobayashi
Session ID: 5B-10
Published: 2014
Released on J-STAGE: July 27, 2018
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Hajime Tomokage
Session ID: 5B-11
Published: 2014
Released on J-STAGE: July 27, 2018
CONFERENCE PROCEEDINGS
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Hirohiko Matsuzawa
Session ID: 5B-12
Published: 2014
Released on J-STAGE: July 27, 2018
CONFERENCE PROCEEDINGS
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Kansuke Ikehara, Kyousuke Nanami, Younggun Han, Tadashi Horiuchi, Woon ...
Session ID: 5B-13
Published: 2014
Released on J-STAGE: July 27, 2018
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Shintaro So, Tomohiro Takeuchi, Kansuke Ikehara, Kyosuke Nanami, Young ...
Session ID: 5B-14
Published: 2014
Released on J-STAGE: July 27, 2018
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Akihiko Happoya
Session ID: 5B-15
Published: 2014
Released on J-STAGE: July 27, 2018
CONFERENCE PROCEEDINGS
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We develop a 3D-integrated, low-height, small module for 4.48GHz carrier frequency and 560MHz bandwidth wireless transceiver. The module has small dimensions of 4.8mm x 4.8mm x 1mm. Thought it has a small footprint and low-height profile, it can realize a high data transfer rate more than 300Mbps. An LSI, which is integrated with RF analog and digital PHY/MAC circuits, is embedded in the organic resin substrate of the module.
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Kenichiro Hasegawa
Session ID: 5B-16
Published: 2014
Released on J-STAGE: July 27, 2018
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Masahiro Ozeki, Mitsuaki Toda
Session ID: 5B-17
Published: 2014
Released on J-STAGE: July 27, 2018
CONFERENCE PROCEEDINGS
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Masashi Aoki
Session ID: 5B-18
Published: 2014
Released on J-STAGE: July 27, 2018
CONFERENCE PROCEEDINGS
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Development of low profile embedded components suitable for laser via connection or electrically-conductive adhesive is going on now. Standardization = infrastructure construction (e.g. material, component, substrate, machine and quality assurance role) is important for prevailing the brand new technology.
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Atsunori Hattori, Hirotaka Ogawa
Session ID: 5B-19
Published: 2014
Released on J-STAGE: July 27, 2018
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Hideyuki Nasu
Session ID: 5C-01
Published: 2014
Released on J-STAGE: July 27, 2018
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The optical packaging technology (OPT) study group at JIEP set up a working group to research leading-edge technologies for editing and publishing “optical packaging technology roadmap”. After publishing the last report in 2010, the working group have listened voices of users particularly to clarify the next challenges for further popularization of optical interconnections. As a whole, we derived four key words of reliability, power consumption, mounting density, pricing. The OPT study group has been focused on technical researches where we discussed mounting density and power consumption in former works, but we have not discussed reliability topics for details. In the latest edition, reliability topics were set to a major part and other technical items we discussed formerly were updated based on the latest trends. To do it, we specifically clarified the requirements in reliability parameters in super computers and router systems as the strongest leading force to popularize optical interconnection. Next, targeting the required reliability, we clarified achievable levels of reliability with existing technologies. We also studied elemental technologies in the future development where expected performances included with reliability topics are also discussed.
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Tadayuki Enomoto, Yukinobu Soeda, Osamu Mikami
Session ID: 5C-02
Published: 2014
Released on J-STAGE: July 27, 2018
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Yukinobu Soeda, Tadayuki Enomoto, Osamu Mikami
Session ID: 5C-03
Published: 2014
Released on J-STAGE: July 27, 2018
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Sho Yoshida, Daisuke Suganuma, Takaaki Ishigure
Session ID: 5C-04
Published: 2014
Released on J-STAGE: July 27, 2018
CONFERENCE PROCEEDINGS
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Junichi Inoue, Tomohiro Kondo, Kenji Kintaka, Kenzo Nishio, Yasuhiro A ...
Session ID: 5C-05
Published: 2014
Released on J-STAGE: July 27, 2018
CONFERENCE PROCEEDINGS
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Ken Okumura, Eiji Higurashi, Tadatomo Suga, ケイ ハギワラ
Session ID: 5C-06
Published: 2014
Released on J-STAGE: July 27, 2018
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Masato Kurihara
Session ID: 5C-07
Published: 2014
Released on J-STAGE: July 27, 2018
CONFERENCE PROCEEDINGS
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Shoichiro Wakabayashi, Hiroshi Uchida, Hitomi Mutsuga
Session ID: 5C-08
Published: 2014
Released on J-STAGE: July 27, 2018
CONFERENCE PROCEEDINGS
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Wataru Fujikawa, Jun Shirakami, Akira Murakawa, Yukie Saitou, Sunao Yo ...
Session ID: 5C-09
Published: 2014
Released on J-STAGE: July 27, 2018
CONFERENCE PROCEEDINGS
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We studied a technique of patterning method of Cu on polyimide film. The most important issue is adhesion strength between copper and polyimide film. We focused on the surface between silver nanoparticles sintering seed layer and copper electroplating layer. The adhesion strength was improved by surface treatment on silver nanoparticles sintering seed layer before copper electroplating. Then we use Hamaker constant as an indication of surface energy. In addition, the thickness, Vickers hardness and crystalline structure of copper electroplating layer on the printing pattern were the same everywhere by the most suitable surface treatment of silver nanoparticles sintering seed layer .
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Minami Takato, Tatsuya Nishi, Ken Saito, Fumio Uchikoba
Session ID: 5C-10
Published: 2014
Released on J-STAGE: July 27, 2018
CONFERENCE PROCEEDINGS
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Hirotaka Koga, Masaya Nogi, Katsuaki Suganuma
Session ID: 5C-11
Published: 2014
Released on J-STAGE: July 27, 2018
CONFERENCE PROCEEDINGS
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