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In recent years, in small form factor devices such as smart phones,the size of the ground is limited.In particular, the ground isrequired for the radiation of the antenna.If not take the ground area,it is impossible to fully use the capacity of the antenna.We study thecase of mounting the antenna on the mounting circuit paper.

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Recently, the application field of a high-speed differential transmission system has expanded, and a shielded twisted pair (STP) cable is used to improve noise immunity. But it is necessary to consider the grounding of shield sheath in STP cable. In this report, we focused on the pigtail grounding in STP cable. And evaluated the relationship between noise immunity and shield ground connection pigtail of STP cable, experimentally.

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In recent years, via holes is used for the connection of external wiring and internal wiring of the multilayer substrate. When copper foil of wiring layer was processed by laser, melted copper was adhered, so projections called “overhang” are formed around the opening of via hole. Adhesiveness and flatness of plating will be decreased by the overhung, therefore removal process of them will be indispensable. Therefore magnetic polishing method was tried as a novel removal technique in this study.

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Cyanide was detected from the plated film which was plated from cyanide free bath. The cyanide was synthesized in the bath. In some cases, the cyanide was also detected from an activated carbon after activated charcoal treatment. The charcoal treatment also worked to eliminate the cyanide. The cyanide is easily synthesized under the condition with supply of nitrogen and carbon atoms. For example, a representative nickel electroplating bath, Watts bath with glycine and ammonium sulfate, the cyanide was also detected. Caution of cyanide synthesis is necessary and we should carefully treated platting baths which contain compound nitrogen atoms source such as ammonium and carbon atom source such as hydrocarbon. We should also carefully treated disposal of activated carbon after activated charcoal treatment, because they might contain cyanide.

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We investigated the wire bonding reliability and the solder joint reliability of the electroless Ni/Pd/Au plating for semiconductor package substrate. The wire bonding reliability and the solder joint reliability decreased with decrease of the film thickness of electroless Ni plating. In order to solve these problems, we developed the ultra thin electroless Ni/Pd/Au process for fine-pitch design.

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We develop a 3D-integrated, low-height, small module for 4.48GHz carrier frequency and 560MHz bandwidth wireless transceiver. The module has small dimensions of 4.8mm x 4.8mm x 1mm. Thought it has a small footprint and low-height profile, it can realize a high data transfer rate more than 300Mbps. An LSI, which is integrated with RF analog and digital PHY/MAC circuits, is embedded in the organic resin substrate of the module.

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Development of low profile embedded components suitable for laser via connection or electrically-conductive adhesive is going on now. Standardization = infrastructure construction (e.g. material, component, substrate, machine and quality assurance role) is important for prevailing the brand new technology.

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The optical packaging technology (OPT) study group at JIEP set up a working group to research leading-edge technologies for editing and publishing “optical packaging technology roadmap”. After publishing the last report in 2010, the working group have listened voices of users particularly to clarify the next challenges for further popularization of optical interconnections. As a whole, we derived four key words of reliability, power consumption, mounting density, pricing. The OPT study group has been focused on technical researches where we discussed mounting density and power consumption in former works, but we have not discussed reliability topics for details. In the latest edition, reliability topics were set to a major part and other technical items we discussed formerly were updated based on the latest trends. To do it, we specifically clarified the requirements in reliability parameters in super computers and router systems as the strongest leading force to popularize optical interconnection. Next, targeting the required reliability, we clarified achievable levels of reliability with existing technologies. We also studied elemental technologies in the future development where expected performances included with reliability topics are also discussed.

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We studied a technique of patterning method of Cu on polyimide film. The most important issue is adhesion strength between copper and polyimide film. We focused on the surface between silver nanoparticles sintering seed layer and copper electroplating layer. The adhesion strength was improved by surface treatment on silver nanoparticles sintering seed layer before copper electroplating. Then we use Hamaker constant as an indication of surface energy. In addition, the thickness, Vickers hardness and crystalline structure of copper electroplating layer on the printing pattern were the same everywhere by the most suitable surface treatment of silver nanoparticles sintering seed layer .

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