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The 38th JIEP Annual Meeting

Development of vertical wavy structured stretchable microscale patterned interconnects fabricated by micro-corrugation process

[in Japanese], [in Japanese], [in Japanese]

Session ID: 13A1-2
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13A1-2

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

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Analysis of estimation methods on heart rate variability using optical heart rate sensor

[in Japanese], [in Japanese], [in Japanese]

Session ID: 13A1-3
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13A1-3

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

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Development of Knit Sensor for Realization of Ware Device

[in Japanese], [in Japanese], [in Japanese]

Session ID: 13A2-1
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13A2-1

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Investigation of Body Movement Noise Reduction Technique for Over-the-Clothes Electrocardiographic Sensor Using Foam Hyperelastic Material

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Session ID: 13A2-2
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13A2-2

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

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Development of Flexible Hybrid SpO₂ Sensor with Screen-Printing

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Session ID: 13A2-3
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13A2-3

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Prototype of a Liver-Equivalent Phantom for Hyperthermia

[in Japanese], [in Japanese], [in Japanese]

Session ID: 13A2-4
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13A2-4

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Development of environmentally friendly low-resistance circuits

[in Japanese], [in Japanese], [in Japanese]

Session ID: 13A3-2
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13A3-2

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

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Improving the Uniformity of Through-Hole Copper Sulfate Plating by Periodic Reverse Pulse Electrolytic Copper Plating.

[in Japanese], [in Japanese]

Session ID: 13A3-3
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13A3-3

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

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Development of Sputtering Seed Layer Using a Cu-Ni-Ti Alloy

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Session ID: 13A4-1
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13A4-1

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

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Development of a Concentration Measuring Device for Brighteners in Nickel Plating Liquid for in-situ Brighteners management

[in Japanese], [in Japanese]

Session ID: 13A4-2
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13A4-2

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Advanced Technology Development of Squeeze Effect Non-Contact Handling Tool for Semiconductor Chips

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 13A5-1
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13A5-1

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Reduction Behavior of Cu Oxide Particles using Formic Acid Treatment with Pt Catalyst

[in Japanese], [in Japanese]

Session ID: 13A5-2
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13A5-2

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Diamond-based-Heat Dissipation System for GaN devices Integrated by means of Low-Temperature Thermo-compression Bonding using Surface Activation

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Session ID: 13A5-3
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13A5-3

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Evaluation of heat resistance of low-pressure Cu sinter bonding based on particle morphology control by thermal plasma

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Session ID: 13A6-1
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13A6-1

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An optimized approach of adhesion testing condition for lead frame and mold resin

[in Japanese], [in Japanese]

Session ID: 13A6-2
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13A6-2

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Evaluation of Coating Resin Characteristics for Wire Bonding Strengthening in Power Modules

[in Japanese], [in Japanese], [in Japanese]

Session ID: 13A6-3
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13A6-3

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Implementation of travel control on a robot lawn mower using work surface recognition

[in Japanese], [in Japanese], [in Japanese]

Session ID: 13B1-1
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13B1-1

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

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Investigation of the relationship of input energy and fire spreading on PCB

[in Japanese], [in Japanese], [in Japanese]

Session ID: 13B1-2
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13B1-2

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

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A Double-sided cooling SiC power module for EV Traction Inverter

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 13B1-3
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13B1-3

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Packaging and Manufacturability of Low Capacitive Coupling SiC Power Module with Low Permittivity Material

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 13B1-4
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13B1-4

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Analysis of Novel Heatsink Implemented in the Power Module of Automotive Traction Inverter

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 13B2-1
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13B2-1

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

Download PDF (1117K)
Crystalline Control Copper Nanoparticle System for Low-Temperature Sintering

[in Japanese]

Session ID: 13B3-2
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13B3-2

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

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Low-Temperature Sintered Copper Fine Particle System for Bonding

[in Japanese]

Session ID: 13B3-3
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13B3-3

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Low-temperature semiconductor/Ag sinter joining using electric field assisted sintering

[in Japanese], [in Japanese], [in Japanese]

Session ID: 13B4-1
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13B4-1

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Development of low-temperature sintering copper powder with self-reducing properties

[in Japanese]

Session ID: 13B4-2
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13B4-2

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

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Influence of Epoxy-based Binder to Dynamic Percolation of CNT-based Electrically Conductive Pastes

[in Japanese], [in Japanese]

Session ID: 13B4-3
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13B4-3

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

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Modulus analysis of filler-contained resin degradation layer under heat treatment

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 13B4-4
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13B4-4

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Development of copper foil surface treatment technology for fine patterning in MSAP

[in Japanese], [in Japanese], [in Japanese]

Session ID: 13B5-1
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13B5-1

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

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Crack resistance evaluation method of organic insulating material for re-distribution layer

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Session ID: 13B5-2
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13B5-2

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

Download PDF (851K)
Materials Design for Improving Interface Strength by Use of Materials Informatics Based on Public Literature Data and Machine Learning with Molecular Simulation

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 13B5-3
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13B5-3

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Design of underground structure cover with self-complementary slits for wireless telecommunication application

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 13C1-1
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13C1-1

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

Download PDF (858K)
Development of 2.4GHz band L-shaped circular polarized slot antenna

[in Japanese], [in Japanese]

Session ID: 13C1-2
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13C1-2

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

Download PDF (870K)
Design of Antenna for Nano-satellite -Design of S-band Patch Antenna-

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Session ID: 13C1-3
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13C1-3

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

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Broadband Circularly-Polarized Patch Antenna Using Metamaterials with Different Sized Rings

[in Japanese], [in Japanese]

Session ID: 13C1-4
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13C1-4

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

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Investigation of Widening Radiation Angle for Patch Antennas with Multilayered Printed Circuit Board

[in Japanese], [in Japanese]

Session ID: 13C2-1
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13C2-1

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

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Development of slot antennas for nano-satelites

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 13C2-2
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13C2-2

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

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Investigation of transmission characteristics of coplanar waveguides using ITO transparent film

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 13C2-3
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13C2-3

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

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Spice Simulation analysis of 6.78MHz magnetically coupled resonant wireless power transfer using Si-MOSFET-based class E resonant inverter and rectifier

[in Japanese], [in Japanese], [in Japanese]

Session ID: 13C2-4
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13C2-4

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

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Investigation of Transmission Characteristics of Transcutaneous Information Transmission Using Spiral Coil against Misalignment

[in Japanese], [in Japanese]

Session ID: 13C3-1
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13C3-1

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

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Investigation of Superiority of Transmission Characteristics of Human Body Communication over Radiowave Wireless Communication

[in Japanese], [in Japanese]

Session ID: 13C3-2
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13C3-2

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

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Development of long range wireless energy harvesting circuit using multistage cockcroft walton circuit and driving Bluetooth module experiment

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Session ID: 13C3-3
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13C3-3

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

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Development of compact wideband balun using multilayer substrate-integrated coaxial line

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Session ID: 13C3-4
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13C3-4

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

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Optimal Value Search of EMI Filter Parameters in Brush Motor Drive System Using Impact Analysis of Statistical Machine Learning

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 13C4-1
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13C4-1

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Evaluation of dependence of ANN-model prediction accuracy on training data amount for expanding interval solution ranges in multi-objective optimal design

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 13C4-2
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13C4-2

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

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Study on small wireless power transmission system with printed wiring coil using machine learning

[in Japanese], [in Japanese], [in Japanese]

Session ID: 13C4-3
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13C4-3

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

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A map feature fusion method for indoor human target tracking with a single FMCW radar

[in Japanese], [in Japanese], [in Japanese]

Session ID: 13C4-4
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_13C4-4

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

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Quality assurance of lotus type of porous fins by unsteady method

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 14A1-1
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_14A1-1

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

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Interpretation of Heat Transfer Paths by Utilizing Thermal Impedance Distribution

[in Japanese]

Session ID: 14A1-2
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_14A1-2

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

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Measurement of thermal-contact-resistance distribution for semiconductor heat dissipation substrate by using lock-in thermography periodic heating method

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 14A1-3
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_14A1-3

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

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3D digital image correlation measurement of printed circuit board under temperature conditions and application to various evaluation analyses

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Session ID: 14A1-4
Published: 2024
Released on J-STAGE: March 01, 2025

DOIhttps://doi.org/10.11486/ejisso.38.0_14A1-4

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

Download PDF (659K)

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