The reversible deposition-dissolution reactions of zinc in several “water-in-salt” (WIS)-based electrolytes were monitored and compared using an electrochemical quartz microbalance (EQCM). These WIS electrolytes, irrespective of composition, promote reversible zinc deposition with high Coulombic efficiency. The mass change on the electrode, the local viscosity, and the change in the water content differ among electrolyte compositions, possibly because of phase separation to a solid zinc salt-water precipitate induced by the local concentration change of electrolyte during zinc dissolution.
The dependence of the impedances of lithium phosphorous oxynitride (LiPON) thin film and solid electrolyte interphase (SEI) formed by decomposition of some electrolytes on the electrode potential was investigated by electrochemical impedance spectroscopy. A LiPON thin film was prepared on a Ni electrode by radio frequency magnetron sputtering of Li3PO4 under nitrogen atmosphere. The resistance of the LiPON thin film decreased with lowering the electrode potential in an ionic liquid, 1-butyl-1-methylpyrrolidinium bis(trifluoromethylsulfonyl)amide (BMPTFSA) containing 1 M LiTFSA. The similar potential dependence of the impedance of the SEI formed in 1 M LiTFSA/BMPTFSA was observed, suggesting that the Li+ carrier density in the LiPON thin film and SEI increased with lowering the electrode potential probably due to the doping of Li+ from the electrolyte into the thin Li+ conductors in order to compensate the negative charge on the electrode. On the other hand, the potential dependence of the SEI formed in LiTFSA-tetraglyme (G4) solvate ionic liquid was insignificant because of the high concentration of Li+ in the SEI and electrolyte. The resistance of the SEI formed in 1 M LiClO4/EC (ethylene carbonate) + DMC (dimethyl carbonate) (1 : 1 vol%) did not depend on the electrode potential, suggesting the thin and highly Li+ conductive SEI is formed in the organic electrolyte.
Mg plating/stripping reaction in Mg[N(CF3SO2)2]2/glyme based solution is studied by electrochemical quartz crystal microbalance method. During the cyclic voltammetry, the apparent mass decrease is observed in spite of the negative scan. The irregular response also appears in the Mg plating reaction with low constant current density apply. In the cases, Mg plating takes place locally and the size of each plating is relatively large of about 50 µm. The cross-sectional image of the plated Mg is tree-like structure, i.e., the large Mg crystal connects to the substrate with small contact area. From the results, we conclude that the specific Mg morphology causes the restoring force to the quartz substrate, resulting in the apparent mass decrease.

The anodic dissolution (electropolishing) of pure metallic nickel and cobalt in choline chloride-propylene glycol eutectic mixture at a mole ratio of 1 : 3 by holding the voltage at 0.9 V for 40 min at 25 °C. The electrochemical study was further studied by recording a steady-state in the form of I-t profile for both metals. Mass transport is the cause of electropolishing and has been proved from the obtained steady-state. The process of electropolishing makes the metallic surface to be resistive to degradation by corrosion. For characterization of the prepared electropolished surface, two microscopic techniques were used; namely, scanning electron and atomic force microscopies. The SEM images have exhibited relatively high-quality electropolished surfaces in both cases of the surface. The Arithmetic mean roughness (Ra) from the AFM are 198.8 and 132.6 nm for polished surfaces of nickel and cobalt, respectively and Ra are 200.1 and 102.2 nm for unpolished regions of nickel and cobalt, respectively.