A sub-micron-sized metal particle has been used as a jointing material between a semiconductor device and a circuit electrode because of its low-temperature sintering characteristic. In this study, we have investigated a behavior of particles during heating using the molecular dynamics (MD) simulation, and we analyzed the driving force of low temperature sintering characteristic of particles. The Langevin equation and the Finnis-Sinclair potential were used on solving the equation. An Iron particles with a diameter of around 240 Å were heated at temperatures above/below the melting point (
Tm) for the estimation of diffusion coefficient. The average diffusion coefficient near the center of the particle was 10
-5 cm
2/sec at above
Tm and was 10
-8-10
-9 cm
2/sec at below
Tm. On the other hand, the average diffusion coefficient at the outer layer of a particle becomes two or three orders in magnitude bigger than the center of the particle. It is conceivable that an enhanced sintering of nano-particles at low temperature is due to the high diffusion coefficient near the surface.
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