NIPPON GOMU KYOKAISHI
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Volume 79, Issue 1
Displaying 1-9 of 9 articles from this issue
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  • [title in Japanese]
    [in Japanese]
    2006 Volume 79 Issue 1 Pages 1
    Published: January 15, 2006
    Released on J-STAGE: March 12, 2010
    DOIhttps://doi.org/10.2324/gomu.79.1
    JOURNAL FREE ACCESS
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  • [title in Japanese]
    [in Japanese]
    2006 Volume 79 Issue 1 Pages 2
    Published: January 15, 2006
    Released on J-STAGE: March 12, 2010
    DOIhttps://doi.org/10.2324/gomu.79.2
    JOURNAL FREE ACCESS
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  • Effects of Annealing Temperature on the Micro-Aggregation Structure and Properties for Thermoplastic Polyurethane Elastomers
    Satoshi YAMASAKI, Daisuke NISHIGUCHI, Ken KOJIO, Mutsuhisa FURUKAWA
    2006 Volume 79 Issue 1 Pages 3-9
    Published: January 15, 2006
    Released on J-STAGE: March 12, 2010
    DOIhttps://doi.org/10.2324/gomu.79.3
    JOURNAL FREE ACCESS
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    The effects of annealing temperature on the micro-aggregation structure, the mechanical and melting properties of thermoplastic polyurethane elastomer (TPU) were investigated. TPU was composed of poly{(tetramethylene adipate)-co-(hexamethylene adipate)} glycol, 4, 4′-diphenylmethane diisocyanate and 1, 4-butanediol units. The TPU sheets prepared by injection molding were annealed at various temperatures from 23 to 120°C for 4h. Differential scanning calorimetry, pulsed nuclear magnetic resonance and dynamic viscoelastic measurements revealed that the degree of micro-phase separation of the TPUs became stronger with increasing annealing temperature owing to the progress of the formation of well-organized hard segment domains. Dynamic storage modulus of the rubbery plateau region around room temperature and the termination temperature of the rubbery plateau region decreased and increased with increasing annealing temperature, respectively. The temperature sweep experiments for molten TPUs indicated that the critical gel temperature at intersection between G′ and G″, increased with increasing annealing temperature. In addition, the TPUs showed the strain hardening of uniaxial elongation viscosity with increasing annealing temperature owing to residual hard segment domains at the operating temperature. It was revealed that the formation of well-organized hard segment domains by annealing strongly influences on not only mechanical properties but also melting ones of the TPUs.
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  • 53rd International Conference of ISO/TC45-Summary Report
    Isamu Imai
    2006 Volume 79 Issue 1 Pages 10-13
    Published: January 15, 2006
    Released on J-STAGE: March 12, 2010
    DOIhttps://doi.org/10.2324/gomu.79.10
    JOURNAL FREE ACCESS
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  • Development of Organic-Inorganic Nanocomposites and Hybrid Materials by Controlling the Nanostructures
    Yasuharu YAMADA
    2006 Volume 79 Issue 1 Pages 14-21
    Published: January 15, 2006
    Released on J-STAGE: March 12, 2010
    DOIhttps://doi.org/10.2324/gomu.79.14
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    Preparation and properties of nanocomposite and hybrid materials based on poly (methyl methacrylate) (PMMA) and silica were reviewed. The materials are mainly prepared by intercalation, sol-gel and in-situ polymerization methods, and generally have improved thermal and thermo-oxidative stability, mechanical properties, and hardness by incorporating silica component into polymer matrix. Good transparency is obtained when silica nanoparticle is used and finely dispersed in polymer matrix or the strong interaction exists between organic and inorganic phases to enhance the phase miscibility. The strong interaction between two phases is caused by the formation of covalent bonds between PMMA and silica moieties and hydrogen bonds between carbonyl group in PMMA and silanol group in silica surface. The materials are defined as nanocomposites without any or week interaction and as hybrids with strong interaction between two components respectively.
    Surface-functionalized silica is also prepared by reacting silica nanoparticle and silane coupling agents, followed by sol-gel or in-situ polymerization to afford hybrid materials. Properties of the materials varies by controlling the nanostructures and morphologies of the materials. These materials have potential for molding, coating, optical device, and separation applications, and are expected further new applications by controlling the nanostructure and introducing functionality into the molecule.
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  • The Role of Polymeric Materials in Space Application and its Durability
    Rikio YOKOTA
    2006 Volume 79 Issue 1 Pages 22-29
    Published: January 15, 2006
    Released on J-STAGE: March 12, 2010
    DOIhttps://doi.org/10.2324/gomu.79.22
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    This paper presents the science and technology developments in the fields of high performance polymers and their composites for space applications as follows; 1) space environment, 2) advanced composites for spacecraft primary structures, 3) deployable structure applications, 4) films for flexible space applications, 5) space environmental stability of polymeric materials, 6) rubber and adhesives, 7) thermal protection system of the space shuttle, 8) novel advanced composites of heat resistance for primary structures
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  • The Latest Trend of the Emulsion Polymerized Rubbers
    Kiyoshi HOSOYA
    2006 Volume 79 Issue 1 Pages 30-34
    Published: January 15, 2006
    Released on J-STAGE: March 12, 2010
    DOIhttps://doi.org/10.2324/gomu.79.30
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    Most of the emulsion polymerized rubbers are manufactured using radical polymerization reactions by which many monomers can be polymerized and co-polymerized. With this process, many kinds of rubbers are manufactured such as SBR, NBR, CR, ACM and FKM. SBR is mostly used in tire applications, other rubbers are mainly used in automotive applications due to their excellent oil resistant except CR.
    The latest technical improvements are reported on SBR, NBR, ACM and HNBR. In SBR, introduction of third monomer led to reduce the rotating friction. In NBR, new type of NBR was presented, having a rapid cure rate, high modulus and good abrasion properties. In ACM, the new cure system was introduced which shows more durability at high temperature. In HNBR, new type HNBRs were introduced, they have excellent balance properties between cold flexibility and oil resistance.
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  • Soft-Materials for Electronic Components
    Kazunori YAMAMOTO
    2006 Volume 79 Issue 1 Pages 35-41
    Published: January 15, 2006
    Released on J-STAGE: March 12, 2010
    DOIhttps://doi.org/10.2324/gomu.79.35
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    The electronic parts and devices are improved in their performance year by year, because the miniaturization of the electronic equipment is strongly demanded. For example, stacked CSPs (chip size packages) for memory module come to be popular in mobile phones, digital cameras etc. recently. Many kinds of soft-materials are used in electronic materials such as laminates, die-bonding materials, epoxy molding compounds, etc., which are very important in stacked CSPs. In this paper, the features of the electronic materials based on soft-materials and manufacturing processes of stacked CSPs are described.
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  • [title in Japanese]
    [in Japanese]
    2006 Volume 79 Issue 1 Pages 42-43
    Published: January 15, 2006
    Released on J-STAGE: March 12, 2010
    DOIhttps://doi.org/10.2324/gomu.79.42
    JOURNAL FREE ACCESS
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