巻号一覧
79 巻, 8 号
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小川 信之, 永田 員也2006 年 79 巻 8 号 p. 387
発行日: 2006/08/15
公開日: 2010/03/12
ジャーナル フリーPDF形式でダウンロード (106K) -
山崎 敏夫2006 年 79 巻 8 号 p. 388-392
発行日: 2006/08/15
公開日: 2010/03/12
ジャーナル フリーSelective self-adhesive LSR (Liquid Silicone Rubber) offers good adhesion to thermoplastics, but does not adhere to the metal surfaces of molds, so it enables us to operate insert molding without any primers or to make a co-injection molding. This selective self-adhesive mechanism can be explained as follows: The adhesion promoter containing of functional groups X and Y in a molecule is insoluble in silicone polymer. The group X has similar structure to thermoplastic polymer while the group Y can be cross-linked with LSR. When the adhesion promoters added to the LSR migrate to the interface, group X tends to adjust themselves to make an interaction with thermoplastics, which results in strong bonding between LSR and thermoplastics. On the other hands there is a weak interaction between the adhesion promoters and metallic mold owing to the low reactivities of X and Y with metal surfaces.
The selective self-adhesive LSR is mainly applied for keypads of mobile phone, for example, 1) plastic keypads of frame type, and 2) film keypads of filed with silicone rubber. For the frame type, this LSR is usually used through the insert molding to polycarbonate parts, and film keypads are made of polyurethane films with this LSR by the compression molding after dispensation. In both cases, there is a good reason to choose this selective self-adhesive LSR, not only skipping priming process but also reducing labor-costs by eliminating time-consuming handling process.抄録全体を表示PDF形式でダウンロード (9786K) -
稲田 禎一2006 年 79 巻 8 号 p. 393-397
発行日: 2006/08/15
公開日: 2010/03/12
ジャーナル フリーReaction-induced polymer alloy films are useful to the CSPs (Chip Size/Scale Package), which are suitable for compact electronic products with high calculating speed. In particular, to cope with the wide-spreading adoption of Pb-free solders, the films are expected to have excellent reliability through the high temperature reflow process. In this respect, we developed a novel low-modulus die bonding adhesive film, which consists of a low modulus acrylic polymer, a highly heat resistant epoxy resin and nano-size filler. The film showed superior reflow-crack resistance of JEDEC level 1 at 265°C as well as sufficient connection reliability and PCT resistance, in the stacked CSP.抄録全体を表示PDF形式でダウンロード (10817K) -
林 秀臣2006 年 79 巻 8 号 p. 398-405
発行日: 2006/08/15
公開日: 2010/03/12
ジャーナル フリーFPC (Flexible printed Circuit) is important key electronic component especially for advanced electronic equipment. Without FPC such as mobile phone (MP), digital still camera (DSC), video cam coder and digital versatile disk (DVD) could not be realized in a limited volume and weight. This article gives general view of FPC market size, structure, material, production process, Jisso (interconnection and packaging) technology and social requirement of FPC. Materials such as polyimide, LCP (Liquid Crystal Polymers), electro-deposited copper, rolled annealed copper, flame retardant adhesives play important roll. There are two kind of CCL (Copper Clad Laminates). One is 2-layer CCL the other is 3-layer CCL. 2-layer CCL is composed without adhesives. However adhesives are very key materials in FPC production. Flexibility of FPC is both advantage and disadvantage. Roll to Roll production method gives us high productivity to make on the other hand it has less flexibility to production system. New applications of FPC are not only portable equipment but larger one such as automotive application. In automotive application, electronic and thermal property of FPC is qualified. FPC contributes to make electronic equipment small then the material used could be reduced. Using FPC the concept of LCR (Least Consumer Release) will be accelerated.抄録全体を表示PDF形式でダウンロード (13702K) -
稲垣 昇司2006 年 79 巻 8 号 p. 406-412
発行日: 2006/08/15
公開日: 2010/03/12
ジャーナル フリーA recent trend of increasing circuit density and functions of PCB diversifies demands for a solder resist mask. When the solder resist mask was introduced, its demanded property was simply to prevent solder bridge on PCB. However, a photo-imageable solder resist mask, which correspond to high circuit density PCB design was developed to overcome the limitation of the solder resist mask's resolution made by silkscreen printing method. Now days, the photo-imageable solder resist mask that is contact UV exposure and alkaline develop type is a most common solder resist mask for PCB fabrication. The photo-imageable solder resist mask is used in various PCBs e. g. motherboards on PC or TV, IC package (BGA and CSP) substrates, flexible PCBs, and etc. Since these PCBs are made for specialized purposes and functions, demands for solder resist mask for these PCBs become more specific in features and performances.In this paper, basic composition of the photo-imageable solder resist mask and its curing system, features and performance to cope with environmental issues that are halogen free and lead free, UV exposure types, and difference of liquid type and dry film type solder masks are discussed.抄録全体を表示PDF形式でダウンロード (14463K) -
江間 富世2006 年 79 巻 8 号 p. 413-418
発行日: 2006/08/15
公開日: 2010/03/12
ジャーナル フリーThe change of the cell phone and technology of Jisso and the trend of the main devices and the materials (the substrate, semiconductor, liquid crystal display module, battery and soft material and so on) used in it are described.抄録全体を表示PDF形式でダウンロード (13249K) -
下田 達也2006 年 79 巻 8 号 p. 419-425
発行日: 2006/08/15
公開日: 2010/03/12
ジャーナル フリーIT industry greatly depends on high-tech electronics devices using various advanced materials. Recently the devices using soft materials have appeared. These devices would have a great advantage over the conventional ones consisting of inorganic materials, if a simpler and less energy-consumed process is adopted. Micro liquid process (MLP), in which a precise thin film device can be directly formed from functional liquids without removing any materials afterward, would be a good candidate for the process above. The process is often referred as an inkjet printing method.
First, details of MLP are introduced, in which four important sub-processes are highlighted. Then two devices, i. e. an organic-electroluminescence (OEL) device and an organic thin film transistor, are described as an example of the combination of soft materials and MLP. In the OLE device, conjugated polymers are directly patterned into small pixels by the inkjet method which is assisted by self-alignment force caused by surface energy. As a consequence patterning with high precision is achieved. The same principle is applied to narrow channel formation of organic TFTs.
It is proved that the combination of soft materials and MLP is excellent so as to fabricate a new type of high-tech electronics devices with less materials and production energy.抄録全体を表示PDF形式でダウンロード (14120K) -
小川 信之, 永田 員也2006 年 79 巻 8 号 p. 426-427
発行日: 2006/08/15
公開日: 2010/03/12
ジャーナル フリーPDF形式でダウンロード (313K) -
長野 悦子2006 年 79 巻 8 号 p. 428
発行日: 2006/08/15
公開日: 2010/03/12
ジャーナル フリーPDF形式でダウンロード (183K)
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