The formation of silicon oxide films by ECR plasma anodization, which is a low-temperature, dry anodizing method, with O
2, N
2O, and O
3 gases is reported from a view point of improving the anodizing efficiency and the anodized film quality. The active oxidizing species in anodization of Si was identified by analyzing the spectra of ECR plasma emission: plasma atomic oxygens play an important role in the anodizing process because the oxide growth rate strongly depends on the density of plasma atomic oxygen. The XPS and AES analysis revealed that the as-grown silicon oxide films anodized with N
2O and O
3 gases are the stoichiometric SiO
2 just as the silicon oxide film anodized in ECR plasma of O
2 gas. It was also indicated that there exists a quite thin SiO
x (0<x<2) layer between SiO
2 and Si, and that Si ions move across the layer to combine with negative oxygen ions at the SiO
2 SiO
x interface. From the C-V measurement of MOS capacitor fabricated with as-grown SiO
2 film, it was observed that the value of interface state density is almost the same as that grown by thermal oxidation. The value of interface state density slightly depends on types of oxidizing gas or its conditions, possibly due to the sputtering by plasma charged particles.
View full abstract