巻号一覧
117 巻, 1 号
選択された号の論文の11件中1～11を表示しています
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杉原 正久, 南 和幸, 江刺 正喜1997 年 117 巻 1 号 p. 3-9
発行日: 1996/12/20
公開日: 2009/04/01
ジャーナル フリーWe have developed micro assembly technique which uses polymer and conductive material deposited by laser CVD as adhesive. Following techniques were adopted to increase the deposition rate. Continuous wave (CW) ultraviolet (UV) laser was used. The substrate was cooled to condense the source gas on the surface. To avoid depositing on a quartz window of the chamber, N2 gas flow was given directly under the window.
Maximum polymer deposition rate by the laser CVD system was about 10μm/min. The deposited polymer was used to bond a SMA coil actuator to a silicon-glass structure for an active catheter.
Maximum deposition rate of conductive material by the laser CVD system was about 3μm/min. The resistivity of conductive material was very high, because carbon and oxygen were contained in them. Therefore the deposited conductive material could not be utilized for micro assembly with electrical connection.抄録全体を表示PDF形式でダウンロード (2138K) -
Seongho Kong, Kazuyuki Minami, Masayoshi Esashi1997 年 117 巻 1 号 p. 10-14
発行日: 1996/12/20
公開日: 2009/04/01
ジャーナル フリーReactive ion etching (RIE) systems using capacitively coupled plasma (CCP) and inductively coupled plasma (ICP) sources with SF6 gas have been developed for deep silicon machining with high aspect ratio. The developed RIE systems demonstrated high etch rate (2.3μm/min) and high selectivity (1700) for a sputtered nickel mask in silicon etching. A large capacity turbo molecular pump (TMP) with a small etching chamber was used to realize a low pressure with a high flow rate of etching gas. A circulatory cooling apparatus was used for cooling a silicon wafer. Etch rate showed uniformity within 10% for the area of 50cm2. Using the RIE system, we succeeded to etch a 200μm thick silicon wafer vertically through the thickness with an aspect ratio greater than 10. The RIE can be applied to fabricate three-dimensional silicon microstructures.抄録全体を表示PDF形式でダウンロード (2299K) -
中村 和人1997 年 117 巻 1 号 p. 15-19
発行日: 1996/12/20
公開日: 2009/04/01
ジャーナル フリーA precise drilling technology with cross section control for use on thin ceramic materials has been developed using Excimer laser photo-ablation process. An homogenous illumination optical system and projection system of high resolution optical elements are applied to a newly designed mass production system. Homogeneity of laser energy under±5% on the mask surface has been obtained by the illumination system, making a final hole array with a distribution of exit hole diameter of 3.5±0.7μm in one processing field of 1.2×1.2mm square area. If a crack occurs in the process because of high repetition rate or high energy from the laser, productivity declines. Designing a specimen holder and He-gas assist enabled cracks to be avolded even at high repetition rate of 200Hz.
This paper describes hole array drilling technique with cross section control of ceramics by multi musk method, production system and an application.抄録全体を表示PDF形式でダウンロード (2401K) -
Yamato FUKUTA, Terunobu AKIYAMA, Hiroyuki FUJITA1997 年 117 巻 1 号 p. 20-26
発行日: 1996/12/20
公開日: 2009/04/01
ジャーナル フリーThis paper presents a new reshaping technology which is suitable to realize real three dimensional silicon microstructures. In this process, the elastically deformed polysilicon structure is annealed by Joule heating generated by the current passing through the structure. Plastic deformation occurs resulting in permanent three dimensional shapes. The application of this basic process to different polysilicon structures is successfully performed. Some quantitative characteristics of the annealing effects are also investigated by means of structure deformation measurements.抄録全体を表示PDF形式でダウンロード (3096K) -
中村 滋男, 中村 洋介, 安宅 学, 藤田 博之1997 年 117 巻 1 号 p. 27-32
発行日: 1996/12/20
公開日: 2009/04/01
ジャーナル フリーTo realize simple and powerful micro actuators, we have developed a new patterning method of TiNi shape memory alloy (SMA) thin films. This method supplies us attractive SMA micro structures from the viewpoint of aspect ratio. In the fabrication, we applied a lift-off process with a thick polymide mold layer and patterned a high aspect ratio SMA structure. The reason why we apply the lift-off process is that the structure's inner stress is lower than that obtained by wet or dry etching processes. By using this method, we have patterned structures of 20μm in width and 10μm in height. The aspect ratio of this structure is 0.5. The patterning accuracy is about 4μm. This process is useful to realize SMA micro actuators of TiNi thin films.抄録全体を表示PDF形式でダウンロード (2257K) -
微細スパイラル電極の形成山形 豊, 森田 晋也, 新野 俊樹, 山本 晃生, 樋口 俊郎1997 年 117 巻 1 号 p. 33-38
発行日: 1996/12/20
公開日: 2009/04/01
ジャーナル フリーA new fabrication method for electrostatic actuators is proposed. This method uses precision cutting technique to fabricate minute grooves which will be filled up with electro-plated metal layer to from fine three phase electrodes. Two types of sample electrodes with 40 micrometer pitch are fabricated on the surface of cylinders of 10mm diameter polyimide. One of the fabricated electrode was able to drive insulating fluid by applying pulse voltages. Though there were some defects on those electrodes, the breakdown voltage was as high as 1000V, which shows the potential ability of this fabrication method.抄録全体を表示PDF形式でダウンロード (2500K) -
柳沢 佳一, 桑野 博喜, 中野 聡子1997 年 117 巻 1 号 p. 39-44
発行日: 1996/12/20
公開日: 2009/04/01
ジャーナル フリーA high-aspect-ratio and precise patterning of thick polyimide film has been achieved using a 50-μm-thick polyimide film masked by 0.1-μm-thick Ta film. The film was etched by a low-energy N2 ion beam with a single-grid Kaufman-type ion source. The selective ratio of the polyimide film vs. the Ta film reached more than 600. The wall angle of the polyimide pattern was about 2°. Etching rate experiments and XPS, FTIR, AFM analysis suggest that N2 ion beam etching is a reactive ion etching.抄録全体を表示PDF形式でダウンロード (3016K) -
中尾 政之, 畑村 洋太郎1997 年 117 巻 1 号 p. 45-54
発行日: 1996/12/20
公開日: 2009/04/01
ジャーナル フリーTo fabricate micro machines, the authors designed, constructed, and evaluated a tabletop, integrated factory called "nano manufacturing world (NMW)". In NMW, we accommodates a compact layout where fabricating/handling machines are concentrated around a workpiece, and a tele-operation system between the processing site and the operating site, which involves dynamic, realtime, high-resolving and 3D images using scanning electron microscopes. We developed various working processes in NMW: e.g. fast atom beam etching, micro assembling using a concentrated motion manipulator. Through the demonstration of fabricating some 3-dimensional micro structures, we evaluate that NMW functions effectively as intended, and will become a solution for micro manufacturing system.抄録全体を表示PDF形式でダウンロード (4836K) -
飯橋 真輔1997 年 117 巻 1 号 p. 55-56
発行日: 1996/12/20
公開日: 2009/04/01
ジャーナル フリーPDF形式でダウンロード (1434K) -
伊藤 高廣, 輿水 博, 松井 伸介, 澤田 廉士1997 年 117 巻 1 号 p. 57-58
発行日: 1996/12/20
公開日: 2009/04/01
ジャーナル フリーPDF形式でダウンロード (818K) -
藤田 孝之, 水野 卓也, 前中 一介, 前田 宗雄1997 年 117 巻 1 号 p. 59-60
発行日: 1996/12/20
公開日: 2009/04/01
ジャーナル フリーPDF形式でダウンロード (966K)
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