電気学会論文誌E(センサ・マイクロマシン部門誌)
Online ISSN : 1347-5525
Print ISSN : 1341-8939
ISSN-L : 1341-8939
122 巻, 9 号
選択された号の論文の5件中1~5を表示しています
論文
  • Shin-ichirou Tezuka, Satoshi Kato, Hitoshi Hamanaka, Tetsuya Watanabe, ...
    原稿種別: Others
    専門分野: Others
    2002 年 122 巻 9 号 p. 427-432
    発行日: 2002年
    公開日: 2003/03/28
    ジャーナル フリー
    This paper discusses a method of analyzing the adhesion problem of arbitrary-shaped microstructures using FEM and an optimization. We have applied our method to square plates, and obtained realistic curved adhesion shapes. We fabricated square plates as test samples, and calculated γs of these samples by using our method. Adhesion criteria are also derived by numerical calculation. We then redesigned the adhesion samples by applying this method, and subsequent tests showed no adhesion of the samples.
  • 大野 博美, 斎藤 正男
    原稿種別: その他
    専門分野: その他
    2002 年 122 巻 9 号 p. 433-439
    発行日: 2002年
    公開日: 2003/03/28
    ジャーナル フリー
    The echograph by ultrasound is widely utilized. Because of the complex structure inside of the body, however, the image is affected. Usually, it is assumed that the transmitted pulse progresses without phase distortion, and only the amplitude decay is compensated in imaging. The estimation of the internal structure by reflected ultrasound is formulated as a problem, where the reflected wave from the transmitted pulse is observed on the body surface, based on which the characteristic impedance of the cascade structure is to be estimated. When there is an attenuation, however, this problem is improperly-posed and the solution is not unique. This paper examines to what extent the solution obtained by the conventional method deviates from the actual structure, considering the phase distortion of the waveform.
  • 金丸 昌敏, 河野 竜治, 遠藤 喜重, 細金 敦
    原稿種別: その他
    専門分野: その他
    2002 年 122 巻 9 号 p. 440-446
    発行日: 2002年
    公開日: 2003/03/28
    ジャーナル フリー
    A new type of micro-probe substrate is designed and fabricated for semiconductor chips that has high-density and fine-pitch electrode pads made by micro-machining. The probe substrate consists of an array of micro-probes 25μm high, on beams formed individually with a pitch of 110μm. It is fabricated by a micro-machining process using anisotropic silicon etching and multi-layer mask techniques.
  • 小川 茂樹, 桑野 博喜
    原稿種別: その他
    専門分野: その他
    2002 年 122 巻 9 号 p. 447-451
    発行日: 2002年
    公開日: 2003/03/28
    ジャーナル フリー
    Methods to remotely monitor and check underground fuel tanks are strongly needed from the viewpoint of environmental protection. This paper presents our temperature-compensated ultrasonic liquid-level meter. By connecting the meter to a telecommunications network, the liquid level in a remotely located tank can be continuously monitored. In our ultrasonic liquid-level meter, we use a reflection ring at the reference position to compensate for measurement error caused by changes of atmospheric temperature. The maximum measurement error is within ±5mm from −10°C to +20°C at a measurement distance of 2000mm. With regard to long-range measurement accuracy, the maximum error has remained within ±2mm over 1.5 years at a measurement distance of 2200mm. In this paper, the structure of the meter, the reflection ring, the configuration of the detection circuit, the superposed signal of transmission and reception, and experimental results are shown.
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