Conductive polymer coated micro-cantilever array made by reel-to-reel continuous fiber process as the electrical contact components for woven electronic textile was investigated. We report the novel cantilever releasing method using air injection and the results of patternable CYTOP and organic conductive polymer using nanoimprinting method. The conductive organic material used in this study is PEDOT:PSS (poly(3,4-ethylenedioxythiophene) poly(4-styrenesulfonate)). Micro-cantilever contact array is realized to compose the electrical circuit through the large area woven textile. The contact resistance of 480 Ω is hold on for over 500 times. Contact resistance measurements revealed that an electric current begins to flow with smaller contact force for PEDOT:PSS coated cantilever array structure than for PEDOT:PSS film structure. There is no appreciable wear on cantilever surface due to its movability after 10³ cycles contact test with 0.5 N contact force. Based on these results, PEDOT:PSS coated micro-cantilever array have excellent potential as electrical contact components between weft and warp for woven electronic textile.

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Ruthenium (Ru), which is one of noble metals, has been intensively considered as an electrode material of DRAM capacitors, since Ru has high oxidation resistance and high electrical conductivity even in the oxidized state. Furthermore, Ru is also expected to be used as an electrode material of acoustic devices, e.g. FBAR, because of its superior acoustic properties such as high Young's modulus and density. For such applications, a precise etching technique for Ru microelectrode patterns is required. Ru etching proceeds by producing volatile oxidized Ru (RuO₄), and is possible using plasma with O₂ or O₂ plus halogenous gas, e.g. Cl₂ and CF₄. However, the plasma etching also attacks resist and/or an underlayer of Si, SiN etc. In this study, a wet etching process with cerium (IV) ammonium nitrate (CAN)-based etchant and a dry etching process with O₃ gas were investigated as low-damage Ru etching processes. O₃ gas etching is better for patterning Ru microelectrodes than CAN-based wet etching. For O₃ gas etching, diluted HF pretreatment is effective to reduce side etching and to improve etching uniformity

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An equivalent circuit model for the semi-parallel plate electrostatic torsion mirror has been developed based on the electrical circuit simulator. An analytical model for the electrostatic torque has been translated into a nonlinear dependent current source as a function of input voltages that interpret the drive voltages and the mirror angle. A use of the suspension width as a fitting parameter explained well the experimental results of frequency response and the mirror's static deflection.

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The DNA transistor is quick, easy and useful sensor of DNA sequencing. But its sequencing requires some chemical liquids and we need external pumps and tubes to provide to the sensor. As a result, the sequencing system is so complex and large. To improve sequencing tools, we consider the integrated system of sensor with pump. In this study, we present the integrated system of sensor (pH sensor) with micro-pump and the monolithic process of the integrated device. We evaluate the micro-pump driving of some liquid samples using pH sensor.

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Many nano-application research have been conducted with development of nanoimprint technologies. In particular, metal or metal-polymer hybrid nanostructures have great potentials as nano-devices such as localized surface plasmon resonance (LSPR) devices, wire grid polarizer (WGP) and organic electronics. The metal embedded polymer periodic nanostructures are also expected as a control substrate to array nanoparticles at three dimensional photonic crystal (3DPC). In this study, we propose and demonstrate new fabrication process based on a combination technique of vacuum evaporation and nanoimprint as a fabrication method for the metal embedded nanostructures. As the result, the PMMA nanodot array (approximate 100 nm in diameter with 300 nm pitch) with gold round films embedded at their bottoms were fabricated successfully using this method. Application to 3DPC and other nanodevices of these nanostructures and fabrication process are described.

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