電気学会論文誌E(センサ・マイクロマシン部門誌)
Online ISSN : 1347-5525
Print ISSN : 1341-8939
ISSN-L : 1341-8939
136 巻, 6 号
選択された号の論文の17件中1~17を表示しています
特集:第32回「センサ・マイクロマシンと応用システム」シンポジウム受賞論文特集
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特集論文
  • 小野寺 武, 田 勝煕, 矢田部 塁, 都甲 潔
    2016 年 136 巻 6 号 p. 218-223
    発行日: 2016/06/01
    公開日: 2016/06/01
    ジャーナル フリー
    Detection method of capsaicinoids such as capsaicin, dihydrocapsaicin and nordihydrocapsaicin was developed using anti-homovalic acid-Concholepas concholepas hemocyanin (CCH) polyclonal antibodies and surface plasmon resonance (SPR) sensor with indirect competitive assay method. Extraction procedure of capsaicinoids from Capsicum fruit was also developed. As a result, limits of detection for capsaicin, dihidrocapsaicin and nordihydrocapsaicin were 27 ppb, 35 ppb and 50 ppb, respectively. The reduction of responses in SPR measurements with indirect competitive method for recovered samples of sweet peppers such as Bell pepper and Shishitougarashi were not observed. Nine kinds of hot peppers (eg. Habanero, Trinidad scorpion), which have different Scovile heat unit (SHU), were also tested. The reductions of sensor responses for the hot peppers were observed. It is likely that samples extracted from Capsicum fruit of the hot peppers contained capsaicinoids. It was found that the responses of the SPR immunosensor depended on SHU of each hot pepper.
  • 加呂 光, 下田 健一朗, 前田 好章, 笹田 一郎
    2016 年 136 巻 6 号 p. 224-228
    発行日: 2016/06/01
    公開日: 2016/06/01
    ジャーナル フリー
    Fundamental mode orthogonal fluxgate(FM-OFG) is low noise magnetometer because the Barkhausen magnetic noise arising from the core is suppressed by the dc bias current in the excitation. We have established a technique to operate 36 channel FM-OFG sensor array by adding the phase control section to the driving electronics in order to make easy the phase angle adjustment of each of the channel. We have succeed to measure the MCG by using the 36 channel sensor array and a lightweight magnetic shield under the environment of urban magnetic noise. The obtained MCG clearly shows amplitude distributions at the QRS-wave and T-wave similar to those measured by the SQUID MCG measurement system.
  • 加藤 義基, 平井 義和, 亀井 謙一郎, 土屋 智由, 田畑 修
    2016 年 136 巻 6 号 p. 229-236
    発行日: 2016/06/01
    公開日: 2016/06/01
    ジャーナル フリー
    In vitro cell-based assay with human cells is getting attention since the accuracy of preclinical predictions of drug responses should be improved to reducing costly failures in clinical trials. In order to generate reliable predictions, we present a micro-engineered biomimetic systems “Body-on-a-Chip”, to investigate the effects of drugs/metabolites on various organs by assembling a closed-loop medium circulation system on one microfluidic device. For three-dimensional (3-D) polymeric device fabrication, an advanced 3-D lithography with the process optimization method is applied to improve the current soft-lithography technique. Our Body-on-a-Chip is successfully applied to evaluate the effect of an anti-cancer drug (doxorubicin) on cell survival of human heart and liver cells.
  • 佐藤 史朗 , 福士 秀幸 , 江刺 正喜 , 田中 秀治
    2016 年 136 巻 6 号 p. 237-243
    発行日: 2016/06/01
    公開日: 2016/06/01
    ジャーナル フリー
    This paper describes hermetic seal wafer bonding using Al covered with thin Sn as an antioxidation layer. The bonding temperature is below 400℃, which is the maximum temperature of CMOS-LSI backend process. Gas tightness over 3000 h at room temperature and sealing stability through heat treatment under a typical reflow condition of 260℃ for 10 min were confirmed for samples bonded at 370℃ and 380℃. A key for successful hermetic seal bonding is relatively high bonding pressure and stress concentration on sealing frames as narrow as several ten microns. The results of SEM and EDX analysis suggested that the bonding was due to direct Al-Al bonding, while Sn was diffused sparsely among Al grain boundaries. The developed bonding technology is usable for wafer-level integration of LSI and MEMS in conjunction with hermetic sealing.
  • 渡邉 恭拓, 佐々 文洋, 吉積 義隆, 鈴木 博章
    2016 年 136 巻 6 号 p. 244-249
    発行日: 2016/06/01
    公開日: 2016/06/01
    ジャーナル フリー
    Microfluidic techniques can be a basis to realize user-friendly microanalytical devices of high performance. Required operations include injection of solutions to reaction chambers, volume measurement, and mixing of solutions. For this purpose, the use of surface tension is attractive. In hydrophobic flow channels, solutions can be moved stably in the form of plugs. Otherwise, solutions can be transported by capillary action in a hydrophilic flow channel and stopped at a hydrophobic valve. The valve can be opened autonomously by switching the mixed potential by wetting a zinc electrode formed in a controlling flow channel. In this review paper, we introduce some of our microfluidic devices particularly focusing on devices that work based on surface tension.
  • 田邊 皓司, 吉積 義隆, 土谷 信之介, 薄葉 亮, 鈴木 博章
    2016 年 136 巻 6 号 p. 250-255
    発行日: 2016/06/01
    公開日: 2016/06/01
    ジャーナル フリー
    There is a strong interest in on-site rapid analysis and monitoring of the activity of cells and biological samples. Such analyses contribute not only to the understanding of cell functions but also to the improvement of point-of-care testing (POCT) and quality-of-life. In promoting miniaturization and integration of sensing components, electrochemistry is advantageous. By coupling this technique with microfluidic techniques, additional functions that can never be realized with only independent sensors can be realized. In this review paper, we introduce our recent electrochemical devices, particularly focusing on analyses of cell functions and biological samples.
  • 饗庭 清仁, 池上 晃平, 山崎 真之亮, 菅野 公二, 磯野 吉正
    2016 年 136 巻 6 号 p. 256-260
    発行日: 2016/06/01
    公開日: 2016/06/01
    ジャーナル フリー
    This paper reports on highly-sensitive adenine molecule detection by surface enhanced Raman spectroscopy with single molecule sensitivity using directionally and regularly arrayed gold nanoparticle dimers with the diameter of 100 nm on the substrate. A particle dimer shows huge electromagnetic enhancement when particle connection direction is matched to polarization direction of light. In this study the dimers were arrayed by the nanotrench-guided self-assembly for generating huge total Raman enhancement. The fabricated structures were used for adenine molecule detections of 10-11 M aqueous solutions. We successfully detected the molecules at the ultra-low concentration, which indicates single molecule sensitivity. The concentration limit of detection had previously been 10-8 M in the reported literatures, which used the simple method with the prefabricated SERS substrate. Our developed substrate exhibited 103 times sensitivity. The clear peaks were found at the integration time of 0.1 s. We confirmed that our developed SERS substrate enables us to detect adenine molecules with high sensitivity and short integration time.
  • 西山 宏昭, 齋藤 泰登
    2016 年 136 巻 6 号 p. 261-265
    発行日: 2016/06/01
    公開日: 2016/06/01
    ジャーナル フリー
    Electrostatically tunable plasmonic devices were fabricated on multi-photon polymerized three-dimensional microsprings. The tunable device was comprised of a plasmonic microplate, two microsprings and a support part. Surface plasmonic modes were excited using high order diffraction on the Au gratings of the devices. Such diffraction allowed for plasmon propagation even on microscale metallic structures. The plasmon excitation efficiencies could be continuously modulated from almost zero to maximum by inclining the microplates with the application of DC voltage up to 40 V. Dynamic functionality offers opportunities for further integration of other optoelectronic components and tunable metamaterials.
  • 日暮 栄治, 須賀 唯知
    2016 年 136 巻 6 号 p. 266-273
    発行日: 2016/06/01
    公開日: 2016/06/01
    ジャーナル フリー
    Wafer-level packaging is one of the most important aspects in manufacturing of sensor and microelectromechanical system (MEMS) devices. It determines the cost, yield, reliability, and long-term stability of these devices. In recent years, low-temperature wafer bonding has become a very important packaging and sealing technology for the realization of advanced devices integrated with dissimilar materials. This paper focuses on low temperature sealing technologies (< 200°C) using metal thin films and solders and reviews the state-of-the-art low-temperature sealing technologies.
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