For MFP (Multi Function Peripheral)development, simulations are surely informative to figure out temperature increase that is by-product. This paper shows current methods with categorizing into main body and electronics unit. In case of electronics cooling, although CFD (Computational Fluid Dynamic)tool performance has been advancing, how to estimate heating value at device that is boundary conditions cannot be fixed. Author keeps experiment to a minimum by searching an apt system for each range of heat value. In case of the main body cooling, it is ultimately complex system due to the fact that a paper works as a heat transfer media and causes temperature increase at engine and everywhere inside a machine. The development engineers are requested to timely propose low-cost parts configuration with considerations to the aspects such as local cooling, heat exhausting and ozone emission, during short developing term. Therefore, phenomenon that are difficult to predict such as a transition of paper temperature after fusing and temperature of the area affected by toner behavior, are treated as a simple experience model.
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