Bonding of UO
2 particles composing compacts which had been swaged at room temperature or at high temperatures up to 1, 100°C, and which were annealed at high temperatures up to 1, 100°C for 20 min after swaging is discussed in their relation to swaged UO
2 density, dissolution time in nitric acid solution, specific surface area and microphotographic observations. UO
2 particles are bonded leaving closed pores by repeated compressive stress and temperature rise resulting from plastic deformation during hot swaging above 800°C. Annealing above 800°C for 20 min after swaging is effective for further particle bonding, an effect which might be termed “Age particle bonding”, which is associated with atom diffusion accompanied by relief of stress induced in the UO
2 particles by the swaging. Age particle bonding occurs gradually also at room temperature.
抄録全体を表示