Miniaturization, cost reduction and higher performance in RF wireless communication products are demanded for constructing a ubiquitous computing network system. To fulfill these demands, we propose an organic built-up circuit board with various embedded passive ceramic component films for the next-generation RF modules.
In the circuit board we propose, ceramic films have to be built-up on a resin substrate at a temperature lower than the endurance temperature of the resin. Our novel aerosol deposition (ASD) method through the use of accelerated ceramic nano-particle bombardment is therefore one of the most effective deposition methods for the ceramic film.
We describe a novel ASD approach to fabricate embedded capacitors on organic flame retardant type 4 (FR-4) substrates and the correlation between the microstructure and dielectric properties of ASD dielectric films deposited under various conditions. We also confirmed the formation of dense BaTiO
3 dielectric films on organic substrates at room temperature. Embedded capacitors on an FR-4 substrate, fabricated as a prototype with this ASD film, had a capacitance density of 300 nF/cm
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