Journal of The Japan Institute of Electronics Packaging

Journal of The Japan Institute of Electronics Packaging

Published by The Japan Institute of Electronics Packaging

3,876 registered articles
(updated on November 15, 2025)

Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677

JOURNAL PEER REVIEWED PARTIALLY RESTRICTED ACCESS ADVANCE PUBLICATION
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2025 Volume 28 Issue 7

Wearable Device for Continuous Monitoring of Insensible Sweating Seiya Tsujimura, Hanlin Ding
Implantable Wireless Devices for Cancer Therapy Kento Yamagishi, Masato Saito, Michinao Hashimoto, Toshinori Fujie, Yuji Morimoto
Introduction to the Special Edition Hiroshi Shiigi
[title in Japanese]

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Most viewed articles (October 2025)

1

The Status and Trend of Inter Layer Insulating Materials for Semiconductor Packages

Released on J-STAGE: February 24, 2012 | Volume 14 Issue 5 Pages 398-403

Hirohisa Narahashi, Shigeo Nakamura
2

Fundamentals of Thermosetting Resins

Released on J-STAGE: March 18, 2010 | Volume 4 Issue 6 Pages 537-542

Masao TOMOI
3

The Past and the Future of Interposer Technology for Driving Solutions to High-Density Device Integration

Released on J-STAGE: August 01, 2019 | Volume 22 Issue 5 Pages 361-366

Osamu Shimada
4

Actual Conditions and Challenges of Accelerated Test

Released on J-STAGE: August 03, 2011 | Volume 13 Issue 7 Pages 502-506

Hirokazu Tanaka
5

Prediction of Thermal Contact Resistance for Thermal Design of Electronics

Released on J-STAGE: March 01, 2021 | Volume 24 Issue 2 Pages 174-177

Tomoyuki Hatakeyama, Risako Kibushi, Yoshiki Hyodo, Masaru Ishizuka

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Predecessor

Circuit Technology

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

Related journals

Transactions of The Japan Institute of Electronics Packaging

Proceedings of JIEP Annual Meeting

Proceedings of Microelectronics Symposium

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