パルスYAGレーザを川いたPbフリーはんだのフラックスレスにおける接合特性を検討した。接合特性は微小めっきピン接合継手の引張強度で評価することとし, レーザ照射条件, めっき組成と構造の影響を検討した。継手性能はレーザのピークパワーと照射時間に依存した。適性エネルギ範囲では, 照射時間が長い方が接合強度が高くなる。短時間接合では未接合部がかなり生じるためで, 強度上昇はぬれの進展と対応していた。フラックスを川いた接合部にレーザを照射すると強度上昇がみられ, 組織微細化によると考えられた。

抄録全体を表示

A high-speed optical link via plastic optical fiber (POF) and its application to the optical interconnection technology is reported. To achieve an extremely simple and compact setup of a high-speed optical link, we have fabricated a gigabit-per-second plastic molded optical transmitter/receiver module with a 780-nm laser diode and a pre-amplifier integrated with a MSMPD. Our modules consist of optical devices and versatile logic-gates with a directly-connected configuration. The optical link has performed a 1.25-Gb/s operation and we have confirmed a 100-m transmission.

抄録全体を表示

Strength evaluation for the wire is very important to avoid crack generation at the selection of materials and the structural design of semiconductor packages. This paper describes the strength evaluation for a wire with the copper-cored semiconductor package. A simplified FEM model targeting issues at the package structural design was developed and its validity was checked against a more elaborated FEM model. From the FEM analysis of thermal stress induced by the difference of thermal expansion coefficients of the composite materials and the detection of crack generation during the thermal cyclic test, it has been clarified that the point location where the maximum thermal stress appears coincides with the one where the crack occurs. Through a series of FEM analysis, it has been proved that the cause of a crack is strongly related to the gap between the lid and the copper core and the suitable length of the gap to prevent crack has been obtained. A new semiconductor package based on the proposed strength evaluation method is working well without cracking. Thus, the capability and validity of the proposed evaluation method has been proved.

抄録全体を表示

電子回路部品実装技術委員会注: 本論文は, 『回路実装学会誌』Vol.12No.2 (1997年3月号) 掲載の本講座第2回「樹脂系多層配線板は今後どうなる」 の論文中で, “ビルドアップ多層配線板は, 絶縁層の塗布, 穴あけ, 導体パターン形成をシーケンシャルに行う製法のため高価になることは避けられない”との内容に対して, コストアップを抑えるビルドアップ配線板製造法の一提案として, 現在検討中の新規な材料と製造プロセスについて投稿されたものである。

抄録全体を表示