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Hiroshi HAJI
2007 Volume 10 Issue 1 Pages
1
Published: January 01, 2007
Released on J-STAGE: November 26, 2010
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[in Japanese]
2007 Volume 10 Issue 1 Pages
2-3
Published: January 01, 2007
Released on J-STAGE: November 26, 2010
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[in Japanese]
2007 Volume 10 Issue 1 Pages
4-7
Published: January 01, 2007
Released on J-STAGE: November 26, 2010
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[in Japanese]
2007 Volume 10 Issue 1 Pages
8-10
Published: January 01, 2007
Released on J-STAGE: November 26, 2010
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[in Japanese]
2007 Volume 10 Issue 1 Pages
11-13
Published: January 01, 2007
Released on J-STAGE: November 26, 2010
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[in Japanese]
2007 Volume 10 Issue 1 Pages
14-17
Published: January 01, 2007
Released on J-STAGE: November 26, 2010
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[in Japanese]
2007 Volume 10 Issue 1 Pages
18-22
Published: January 01, 2007
Released on J-STAGE: November 26, 2010
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[in Japanese]
2007 Volume 10 Issue 1 Pages
23-26
Published: January 01, 2007
Released on J-STAGE: November 26, 2010
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[in Japanese]
2007 Volume 10 Issue 1 Pages
27-29
Published: January 01, 2007
Released on J-STAGE: November 26, 2010
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[in Japanese]
2007 Volume 10 Issue 1 Pages
30-33
Published: January 01, 2007
Released on J-STAGE: November 26, 2010
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[in Japanese]
2007 Volume 10 Issue 1 Pages
34-37
Published: January 01, 2007
Released on J-STAGE: November 26, 2010
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[in Japanese]
2007 Volume 10 Issue 1 Pages
38-41
Published: January 01, 2007
Released on J-STAGE: November 26, 2010
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[in Japanese]
2007 Volume 10 Issue 1 Pages
42-51
Published: January 01, 2007
Released on J-STAGE: November 26, 2010
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Toshinobu TANIMURA, Qiang YU, Tadahiro SHIBUTANI, Jae-Chul JIN, Masaki ...
2007 Volume 10 Issue 1 Pages
52-61
Published: January 01, 2007
Released on J-STAGE: November 26, 2010
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This paper reports on the intensive investigation of a method to estimate the lifetime of solder joints in electronic equipment. Assessing thermal fatigue reliability requires knowledge of the mechanical properties of the inelasticity of solder joints at several temperatures. However, measuring solder properties is expensive and time consuming. A quick and simple investigating technique is needed immediately. In this article, a tensile test with a relaxation method is proposed in order to obtain several parameters such as creep constant and index, and the viscoplastic parameters defined by L. Anand et al. We compare the acquisition of solder characteristics by the conventional method and the new method, using relaxation part to reduce the numbers of experiments.
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Yuichi SAITO, Katsuhiko TASHIRO, Ichiro KOIWA, Hideo HONMA
2007 Volume 10 Issue 1 Pages
62-66
Published: January 01, 2007
Released on J-STAGE: November 26, 2010
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Electroless nickel plating and immersion gold plating are key inter-connection processes in the manufacture of highly reliable printed circuit boards (PCBs) . However, an extraneous Ni deposition has often been observed between the copper patterns due to the adsorption of Pd on the resin. To develop a method for direct electroless nickel plating on copper circuits without Pd activation, we introduced hydrazine as a secondary reducing agent for the initiation of the plating, because hydrazine can generate Ni nuclei on the copper surface in the initial stage. This process eliminates the Pd activation process, avoiding the extraneous deposition on the resin and achieving highly selective nickel deposition on the copper circuits.
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Fumio UCHIKOBA, Kyohei YAMASHITA, Soyoung PARK
2007 Volume 10 Issue 1 Pages
67-72
Published: January 01, 2007
Released on J-STAGE: November 26, 2010
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Fine patterning of the conductor on LTCC (Low Temperature Cofired Ceramic) green sheets is required for miniaturization of the devices. Although screen printing technology has been used for conductor patterning on the green sheet from the beginning of LTCC development, there are limitations to the fine patterning that can be achieved by this conventional technology. A new method for patterning the green sheet is proposed in this paper to replace screen printing. We attached an optically pre-patterned resist film to the LTCC green sheet, and passed the paste through the pattern slits to form a fine conductor pattern according to the design. The obtained line width was 30μm and the height was 25μm. The remarkable result was that the cross-section of the obtained pattern was almost rectangular. The shape was quite different from the arched cross section produced by screen printing.
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Takehiro TAKAHASHI, Atsushi YOSHIDA, Takashi SAKUSABE, Noboru SCHIBUYA ...
2007 Volume 10 Issue 1 Pages
73-79
Published: January 01, 2007
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The receiving characteristics of electromagnetic interference on the power-ground line of an inverter IC—in other words, its electromagnetic susceptibility—was measured to investigate the dependence of susceptibility on the operating condition of electric and electronic equipment. It was confirmed that the receiving characteristics of the electromagnetic disturbance are different in the driving state of IC. The differences in the susceptibility at High and Low states were also obtained by simple circuit simulation.
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Shogo URA
2007 Volume 10 Issue 1 Pages
80-87
Published: January 01, 2007
Released on J-STAGE: November 26, 2010
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Shigeru KOHINATA
2007 Volume 10 Issue 1 Pages
88-98
Published: January 01, 2007
Released on J-STAGE: November 26, 2010
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[in Japanese]
2007 Volume 10 Issue 1 Pages
Preface
Published: January 01, 2007
Released on J-STAGE: November 26, 2010
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