Journal of The Japan Institute of Electronics Packaging
Online ISSN : 1884-121X
Print ISSN : 1343-9677
ISSN-L : 1343-9677
Volume 21, Issue 7
Displaying 1-22 of 22 articles from this issue
Preface
Special Articles / The Latest Electromagnetic Technology as a Foundation of IoT Equipment and Its Characteristic
Technical Paper
  • Takeaki Shimanouchi, Takashi Katsuki, Osamu Toyoda, Motoaki Tani
    Article type: Technical Paper
    2018 Volume 21 Issue 7 Pages 662-668
    Published: November 01, 2018
    Released on J-STAGE: November 02, 2018
    JOURNAL FREE ACCESS

    We have developed a sensor module for behavior sensing. The sensor module consists of a microcomputer, a communication module, some sensors and a battery. Data are acquired using the sensors and sent to a smartphone in real time by the communication module. The data collected were 3-axis acceleration, 3-axis angular velocity, 3-axis geomagnetism, 3 pressures, bending, atmospheric pressure, and temperature-humidity. It was operated for about 42 hours using a 325 mAh battery. Two sensor modules were put in the insoles of a pair of shoes with the cap type packaging cases. The motion of both shoes was monitored using the two insoles and the acquired data showed that human behavior sensing was possible.

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  • Hajime Ikuno
    Article type: Technical Paper
    2018 Volume 21 Issue 7 Pages 669-675
    Published: November 01, 2018
    Released on J-STAGE: November 02, 2018
    JOURNAL FREE ACCESS

    It is difficult to heat and cool electronic components both uniformly and rapidly because of the low heat conduction of the materials used, for example resin or ceramics. We have developed a new rapid thermal-fatigue test system utilizing an original basic principle where a temperature-controlled air shower is circulated around test bodies to realize both uniform and rapid temperature control even with the simple test apparatus. For a practical electronic circuit board, it was confirmed that the proposed system allowed the target temperature to be approached rapidly while maintaining a uniform temperature distribution. In this paper, using temperature profiles from practical electronic components having larger volume and heavier weight, which are usually hard to heat and cool both rapidly and uniformly, we confirmed that the developed apparatus is able to rapidly approach the target temperature with a uniform temperature distribution in spite of the large internal heat mass.

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