Published by
The Japan Institute of Electronics Packaging
Editor-in-Chief
Toray Engineering
Associate Editor-in-Chief
Furukawa Electric
Editor
Kumamoto University
Editor
KOA
Editor
Fuji Electric
Editor
Toppan
Editor
NTT Innovative Devices
Editor
Nihon University
Editor
Fukuoka University
Editor
Kamiens Technology
Editor
Lintec
Editor
Tokyo Polytechnic University
Editor
Mitsubishi Electric
Editor
ATE Service
Editor
HAKUSAN
Editor
Andor System Support
Editor
Ashikaga University
Editor
Sanjo City University
Editor
TOSHIBA
Editor
DIC
Editor
Agency for Science, Technology and Research
Editor
KYOCERA
Editor
In-Vehicle Packaging Research
Editor
Huawei Japan
Editor
National Institute of Advanced Industrial Science and Technology
Editor
Osaka University
Editor
HIOKI E.E.
Editor
TOSHIBA
Editor
Research Institute for Electromagnetic Materials