In this study, we studied how the structure of the Cu foil, which is used for a substrate, affects tin whisker formation and the structure of the deposited tin films. In particular, we considered the relation between the crystal grain size of Cu foils and the amount of intermetallic compound deposits that is formed at the interface between Sn deposited films with aging and Cu foils. We used two types of Cu foils for a substrate. One is “with gelatin additive” that has granular-shaped grains which are 0.5~1 μm in size and the other is “with Cl
- ion additive” that has pillar-shaped grains and their nodules. And the crystal grain size of the Cu foil with gelatin additive is smaller than the Cu foil with Cl
- ion additive. The structure of tin whiskers, tin films and Cu foils were investigated by TEM and SEM. The number of the whiskers that formed on the Sn deposited film increased after aging. And the number of the whiskers that formed on the Sn film deposited on the Cu foil with gelatin additive was larger than that with Cl
- ion additives. The cross sectional morphologies of tin deposited films and Cu foils were observed from the TEM. From the analysis of TEM diffraction patterns that were obtained by after-aging sample, there was Cu
6Sn
5 intermetallic compound deposits at the interface between the Sn deposited film and the Cu foils. The amount of intermetallic compound deposits formed with gelatin additive was larger than that with the Cl
- ion additive. The morphology of the intermetallic compound deposits was classified as nodular shaped or as layer shaped. We could observe the difference in the amount of nodular-shaped intermetallic compound deposits between the sample with gelatin additive and the samples with Cl
- ion additive.
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