This paper reports the mechanical property and crack propagation behavior of thin ceramics. A method to evaluate the stress intensity factor,
KI, of thin ceramics was proposed. Dependence of
KI values on the average grain size,
d, of thin α-alumina were measured by the method.
KI values of thin α-alumina decreased with increasing d values from 4.3 μm to 15.2 μm, while the
KI values were almost constant for 15.2 μm≤
d≤63.0 μm. The trend of
KI values agreed with the dependence of fracture toughness,
Kc, of bulk α-alumina. The thin α-alumina specimens after crack propagation were investigated by scanning electron microscopic electron back-scattered diffraction (SEM/EBSD) analysis. Branched cracks were hardly observed, regardless of grain size. The result indicates that the toughing mechanism do not occur in the thin α-alumina. Dependence of the transgranular fracture rate,
F, and the crack deflection rate,
D, on
d were measured from the orientation distribution maps. However, the
F values and the
D values were independent of
d and approximately constant. The
F values and
D values depend on
d in bulk α-alumina. It indicates that the crack propagation behavior is varied by thinning α-alumina.
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