以上述べてきたように, サーメット工具といってもその切削特性が材質によって異なるため, 種々の適用範囲において, 得意・不得意といった分野が生じてしまう.
我々工具メーカは, この不得意分野を克服するための材料開発に力点を置くか, 得意分野をより高めるような材料開発を行うかは, 常に使用者側の要求を敏感に感じとって決定すべきである.このことを念頭において今後の研究開発を続けたいと考えている.

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切削加工の高速・高能率化や焼入れ鋼などの切削加工化などコーテッド超硬ドリルや超硬エンドミルに対する要求はますます厳しくなってきている.特に断続切削であるこれらの切削加工においては, 従来のTiN系コーテッド超硬工具では, チッピングが発生し, 短寿命であった.そこで, 最近, 開発・実用化されてきた新コーティングがTiCN系多層膜や (Ti, Al) N膜である.特に (Ti, Al) N膜は耐酸化性が優れており, 高硬度材や高速条件での効果が大きい.さらに超硬素材や形状が改善された結果, 硬さがHRC50~65の焼入れ鋼のドリル加工やエンドミル加工が可能になり, 金型加工の工程を変革する手段として期待されている.また工作機械の高剛性化や高速化に伴って, なお一層の高速切削が推進されており, 今後も切削加工能率の向上に寄与できると期待されている.

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A rheological analysis system of molds was developed with the purpose of improving the yield of molded plastic semiconductor packages and shortening the time required for mold design. The capability for formulation of analytical models, which constitutes the salient feature of this system, will be described in the present paper. This system does not directly model the entire object of analysis, but rather models portions of this object and then integrates these into an overall analytical model. Approximate modelling is effected in such a manner that preprepared standard programs can be used in the respective partial models. The process of synthesizing the analytical model is represented by a hierachical structure of frames, and modelling is accomplished via the three stages of shape partitioning, shape allocation and model decision.

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(1) 従来の曲面を陰関数で表現し動的に変化する柔らかい物体を取り扱う形状モデルを改良して, 工業デザインのアイデア展開段階で工業デザイナーの意匠形状設計の支援を行う形状モデルとして, 幾何形状と自由形状が同じ方式で取り扱え, かつ形状を形状内部の電荷モデルの状態によって操作する濃度空間モデルを提案した.
(2) 濃度空間モデルのプリミティブ形状に濃度分布曲面と減衰率曲面を導入し形状操作を統一的に行う方法を提案して, 形状創成に必要なプリミティブ形状数を減少させ形状制御を容易にできることを示した.
(3) 濃度空間モデルによる意匠形状設計システムを構築し, 形状のバリエーションを生成することによって意匠形状設計において工業デザイナーのアイデア展開を支援できることを確認した.
(4) 形状の微分によって表される形状の連続性が, 濃度プリミティブの影響範囲の設定と組合せによっては保証されない場合がある.濃度空間モデルによる形状の連続性の保証は今後の課題である.また濃度プリミティブの影響範囲の設定と, プリミティブ形状のグループ化によって行う形状の局所制御性の達成も今後の課題である.

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This paper deals with a design method of a tool database to be used in tool use planning. To increase the efficiency of the tool use in a flexible automated manufacturing system, it is necessary for the tool database to support information used in the whole field of the tool life cycle and in the tool use. A management system sharing with some tools in some machine tools and using them, can make the best use of tool capacity. For the realization of this system, the tool use needs information to select tool instance and to deploy it in the place just in time, based on tool status and machining schedule. An activity model of such a system for FMS is constructed for clarifying requirements for a tool database. Then to design such a tool database for satisfying the requirements, this study introduces an object-oriented method such as STEP technology, and implements the database using EXPRESS, C++, and object oriented database system.

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In the finishing operation of bainitic spheroidal graphite cast iron (ADI), the CBN tool was applied at the high cutting speed (high temperature) condition. The effects of Si content in the workpiece material and amount of Al compounds as the major binding phase in the tool on the wear rate of the tool have been investigated. The tool life was much affected by the Si content than the amount of γ-pool phase in the workpiece material. Adhesives formed in the tool flank face was mainly composed by Si. Since the Si diffused into the tool binding phase during operation, the Si content of the workpiece material strongly influenced on the tool wear in the tools containing higher amount of the binding phase. At the condition of the cutting temperature exceeding 1300K, a partial transformation of c-BN into h-BN was observed in conjunction with the formation of the SiAlON phase as the results of reaction between A1N in the tool binding phase and Si in the workpiece materials. The higher the amount of Al compounds in the tool binding phase, the higher became the rate of flank wear with significant effect of the formation of SiAlON on the tool wear.

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This paper describes the tool wear mechanism involved when a cBN tool cuts hardened steel (SUJ2, HRC60). The wear mechanism differs when the cutting speed is above or below 75 m/min. When the cutting speed is below 75 m/min, mechanical wear seems to be the major cause of tool wear. Conversely, above 75 m/min (i.e., in the normal cutting range for cBN tools), substances adhere to the tool wear surface. As the speed increases above this 75 m/min, the adhering substances and wear also increase. During research, when such adhering substances were analyzed, not only were components of the workpiece (Fe) and tool detected but oxygen was found to be distributed similarly to Fe; and FeO was detected in the surface layer of the adhering substances. When a diffusion test was conducted on FeO and a tool, the FeO reacted with the tool's binder. Thus, when the cutting speed is above 75 m/min, the Fe in workpieces apparently reacts with tool binder and oxygen in the air, forming an adhering substance. As a result, adhesive wear is generated.

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The laser diode has been widely used in optical memories and measurements. The laser diode having shorter wavelength is requested for achieving high density optical memories and precision measurements. The second-harmonic-generation (SHG) technology by using nonlinear optical crystals is suitable for getting short wavelength laser. The organic nonlinear optical crystals show the higher second-order-nonlinearity in comparison with conventional inorganic nonlinear crystals. However, the former crystals are very soft and very brittle, so that it is difficult to get optical surfaces by conventional polishing technology. This paper deals with the precision grinding of nonlinear optical crystal of chalcone using the ultra-precision surface grinder and also a new grinding technique named the sandwich grinding method which grinds a soft material with another material having higher grinding resistance at the same time. The ground surface of 16nm Rmax in surface roughness has been generated by the sandwich grinding method.

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By applying electrodischarge truing (ED-T) method to a very thin metal bonded grinding wheel, an efficient and accurate profile truing is accomplished on a grinding machine. When outer periphery of a wheel is trued by the ED-T method, eccentricity of the wheel is reduced only to 1μm p-p. Further, by utilizing the NC movement of a grinding machine in truing outer periphery of a wheel by the ED-T method, profiles such as straight, V and semi V shapes can be formed accurately. By applying the ED-T method to the side of the wheel, complicated profiles such as reversed taper and stepped shapes can be formed. In grinding a groove on Al₂O₃TiC workpiece with an ED-Ted wheel on both outer periphery and side surfaces, reduction of chipping, improvement of straightness and so on are accomplished. By adopting a thin metal bonded grinding wheel as an electrode in the ED-T (named EDG-T method), highly precise truing can been accomplished. In grinding a groove on Al₂O₃ TiC workpiece with the wheel trued by the EDG-T method, improvement of form accuracy, surface roughness and waviness is accomplished.

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Recently, the use of cemented carbides has become widespread for various kinds of die making because of their great resistance to wear and heat. However, the heat-affected zones, in which there are many cracks and micro-craters, are generated by EDM of cemented carbides during the die manufacturing process. These defects remarkably decrease the strength of die and are the main cause of die damage. The present paper deals with a surface modification method using oxidizing treatment as a means of removing these heat-affected zones. This method uses a high-temperature oxidation of the surface of cemented carbides. The oxidized surface layers are soft and can be removed easily. As a result, the heat-affected zones generated by EDM can be completely removed by this oxidizing treatment. The oxidized surface comprises the oxides of cobalt and tungsten. The crystalline structures after the removal of these oxides are transformed to a hexagonal lattice of WC in a stable structure.

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In order to make polycrystalline silicon films at low temperature, hydrogen radicals have been utilized in the rf sputtering process. The films were prepared in gas mixtures containing argon and hydrogen. They were investigated by reflection electron diffraction and Raman spectroscopy. Furthermore, optical emission spectroscopy was employed to study the quantity of hydrogen radicals in the plasma, and the plasma potential was measured to decide the substrate bias voltage under realistic plasma condition for the deposition of silicon films. The results showed that polycrystalline silicon films were grown even at the substrate temperature of less than 200°C. It was also found from the optical emission spectroscopy that there existed atomic hydrogen radicals with high energy of about 10eV. They are expected to be able to restructure the silicon atoms on the substrate. Thus the crystallization at such low temperature is considered to be mainly due to hydrogen radicals in the plasma.

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It is very difficult to obtain high accurate surface by a helical end mill even if finishing condition is selected. The reason is that there is the eccentricity of the axis of the cutter center from the axis of machine spindle. But the surface generation mechanism of by end mills eccentrically attached to the main spindle has not been analyzed. This paper therefore tries to analyze the position of helical edge in the state of eccentricity, and aims at presenting the influence of helix angle and number of teeth on working accuracy. The main results are as follows : (1) The eccentric model for analysis of edge position of the helical end mill that attached on the machine spindle with eccentric condition is proposed, and the calculating method of the envelope surface by helical edge is shown. (2) The four eccentric parameters of the end mill are calculated by using displacements of two rings mounted on the end mill, and the envelope surface is calculated based on the above parameters. (3) It is shown that the shape of machined surface by finishing is almost coincident to that of the envelope surface. (4) The simulation analysis of the envelope surface by helical edge is performed, and it is shown that the influence of helix angle and number of teeth on the shape of envelope surface and the dimensional and shape errors.

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This paper describes a method that recognizes fatality of defects in circuit patterns. It takes the advantage of a fast realtime image-processor to detect “defect candidates”, and of a general purpose image-processor to recognize fatality of the candidates. It has been proven that the developed method well realizes the function of fatality recognition performed by human workers.

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機上3次元形状計測において, 多面体を用いたプローブ先端位置の校正法を考案し, これに基づいてプローブの位置や姿勢を任意に選択して測定を行う形状計測システムを開発した.放電加工機を用いた形状測定を実行し, 次のような結論を得た.
(1) 測定プローブは加工途中では取り外し, 測定段階では被測定面の位置や姿勢に応じて加工機上に取り付けて精密な測定が実施できる極めてフレキシブルな機上計測装置が実現できた.
(2) 加工物の形状のみならず, 複雑な形状の工具電極の形状測定が可能である.特に曲率の大きな部位の詳細な計測が実施できる.本計測システムによる測定精度は, 100mm程度の大きさの物体に対しては±数μm程度であった.
(3) 放電加工の場合は, 電極と加工物の形状測定とともに, お互いに対向する部位における局部的な極間距離を知ることができる.
(4) 本測定システムはNC装置を有する他の加工機械にも適用できる.

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A novel end-point detection technique is proposed for planarization of semiconductor wafers by chemical mechanical polishing. In this technique, a local thickness variation of polished layer is observed in-situ in detail, instead of observing a mean thickness value of the whole layer with conventional technique. The detection head owns two sensors, and mounted on a rotating platen for polishing. The first sensor is a fluid gap gage for measuring a surface position of the polished layer. The second one is an optical pick-up for measuring a bottom position of the layer. A residual thickness value of the polished layer, which is a target of this end-point detection, can be known as difference of the both values. A prototype detector was constructed. The experimental results show a 0.1μm sensitivity and a capability for manufacturing use.

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The linear grating coupler of the optical waveguide element is sensitive to the incident beam angle. This characteristic was considered a weakness when used in a conventional optical measurement system. However, for the inclination measurement, this becomes a valuable characteristic. For example, to obtain higher optical performance in semiconductor lithography system, inclination control of the wafer substrate surface is becoming more important. And a wafer inclination measurement optics attached to the stepper requires high measurement accuracy, ability to deal with patterned and photoresist coated wafer, and compact size and a linear grating coupler has a possibility to satisfy these conditions. To verify inclination measurement ability of the linear grating coupler formed on the optical waveguide element, an experimental system was produced. A collimated spolarized He-Ne laser illuminated the wafer surfaces and coupled beam intensity of the reflected or scattered light from the tested surface was detected. Inclination of the substrate was obtained from the maximum intensity position. Standard deviation of the measurement accuracy of the order of 10^-6rad was confirmed even when a patterned and photoresist coated wafer was measured. The experimental results fit the numerically simulated results.

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Small particles (approximately lager than 1 μm) adhered on to TFT-LCD (Thin Film Transistor-Liquid Crystal Display) plates in a production process cause the defects in circuit patterns. The particles have been detected strictly in a production process by employing automatic inspection systems. In this development, an automatic particle detection system with a high speed and simple configuration has been developed. The high speed inspection has been realized by developing detecting optics whose view field is 4 times as large as conventional optics. The simple configuration has been realized by developing a comparison method along scanning direction of an image sensor. This system is performed so as to detect 1 μm polystyrene latex on a TFT-LCD plate.

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This paper deals with the three-dimensional surface height profiling at lattice sampling points by a stylus instrument for an assessment of relatively long wavelength of isotropic surface texture. The shortest wavelength was derived from the mean spacing between profile peaks at the mean line obtained by a two-dimensional premeasurement using a sufficiently sharp stylus tip. The allowable measuring conditions such as sampling distance and stylus tip radius were determined by considering both the amplitude sensitivity of the displacement transducer and the virtual autocorrelation curves obtained by rolling imaginary circles over the profile. As the number of discrete sampling points is based on the main memory of an ordinary personal computer, the maximum measurement area was inevitably determined. The macroscopic asperity summits were specially taken into account for a purpose of analyzing the interface between two surfaces in contact. The functional summits were detected from an 8-nearest-neighbor analysis. It was demonstrated that the number and location of the obtained summits are influenced markedly by the measuring conditions and the proposed method for choosing stylus tip radius and sampling distance effects a settlement.

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A preliminary system has been developed that recognizes three dimensional position and orientation of a parallelepiped object of rugged surface (nearly parallelepiped object).Three dimensional coordinates of the surface points are taken into the computer by 3-D measuring apparatus mainly composed of laser slit-light projector and CCD camera.These data make small surface elements which are adapted to the most suitable planes. The surface elements are merged together into several large segments based on the density of normal vectors expressed by the extended Gaussian image and on the distance between the elements adjoining each other.Then the object can be described by irregular assembly of simple plane surfaces which should correspond to each regular surface of the parallelepiped.This method was practically applied to a cylinder block of engine, indicating correct answers as long as the particular face that determines the object posture was in a view of the camera.

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