Cerium Oxide (CeO
2) slurry is frequently used for making high precision surface finishes of glass substrate applied for Hard Disk Drive (HDD) and Flat Display (FD). However, CeO
2 is one of the rare metals. Therefore, both reduction of supply amount of CeO
2 slurry and development of new slurry without CeO
2 need to be improved. This paper presents the optimum CMP conditions applying CeO
2 slurry as a parameter of slurry concentration, polishing pressure and platen rotational speed. Moreover, we discuss the advantages of Manganese Oxide (Mn
2O
3) abrasive for replacing CeO
2 abrasive. In the result, it is found experimentally that the proposed conditions are efficient in reduction of CeO
2 abrasive. Moreover, Mn
2O
3 abrasive indicates optimum performance for the polishing of glass substrates.
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