Micro-fabrication with diamond cutting has been developed for machining optoelectronic components such as a diffraction grating, and MEMS components such as μ-TAS. In these components, highly accurate micromachining of submicron order has been realized. However there has been no report with regard to producing 10-nm order depth grooves by the diamond cutting. This paper describes a novel diamond cutting method which enables producing highly accurate 10-nm order depth grooves. In this method, a mirror finished glass substrate, sputter coated with thin soft metal films is used as a workpiece. The workpiece is pressed by a diamond cutting tool at a constant vertical load, while the diamond cutting tool is being moved. By using the glass substrate as a stopper layer, which is not cut by the diamond cutting tool, grooves with the same depth as the thin soft metal films thickness can be fabricated. It was experimentally confirmed that, with the proposed cutting method, a very highly accurate uniform groove, 1.0μm wide and 80nm deep, could be achieved.
抄録全体を表示