製鉄工場の展望といつても,いろいろの眺め方がある訳であります。まずその概要を数字的に展望することにします。それというのは,最近アメリカの証券アナリストの一行,ECAFEの地下水地域セミナーの来訪があつて,その方々に提供した資料がありますので,それを利用することにします。

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Since it is necessary for VHF, UHF and microwave communications to use the quartz oscillator units of high frequency, higher machining accuracy is strictly required for very thin quartz plates. In the first place, the characteristics of two types of plane-parallel. lapping machines suitable for obtaining such thin quartz plates with high parallelism are described, and also the measurements of the thickness of quartz plates under lapping are explained. In the second place, polishing techniques for finishing the surface to "mirror surface" are discussed with regard to the working methods, processes and precise measurements of the mechanical quantities of quartz plates, which have led to the establishment of a basis for making crystals with frequencies of up to 140 Mc/s with sufficient yield. Moreover, from the author's understanding of the deformation of thin polished plates, the nature of skin stresses, stages of worked layers and depths of mechanical disturbances are explained. With the results thus obtained, the mechanism of polishing quartz that is explained as the aggregation of micro-scratchings by points of abrasives in the process of polishing is shown.

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1. As the first attempt of analytical research on cutting mechanics, the deformations of continuous chips were observed in the process of orthogonal machining for copper, stainless steel and lead. The following facts observed are considered to have an important meaning for cutting mechanics.
(i) On the outer surface of a chip (a free surface of material before machining) there are many rough crinkles which are parallel to the direction of width of cutting edge, and each crinkle looks like the shape of both edges of a cold-rolled sheet metal.
(ii) On the inner surface of a chip (a surface contact with a rake surface of tool) there are flow lines inclined to the direction of a frictional force between tool and chip. The field of those inclined flow lines is within 30% of thickness of a chip.
(iii) A plastic deformation takes place in the material before a shear plane, and accompanies a swelling-up portion on its free surface.
2. Many investigators who have researched cutting mechanics, assume a geometrical. model in which a zone of a deformation is regarded as a single shear plane and containing a simple shear deformation only. In this report this geometrical model is called a "simple model of chip formation."
On the other hand, from the above mentioned facts, the author assumes a new geometrical model in which the deformation takes place in a plastic zone and accompanies a swelling-up portion on the free surface of material. This new geometrical model contains deformations by simple shear and pure shear, and is called a "complex model of chip formation."
3. In the complex model of chip formation the author assumes a simple shear deformation which equals to the energy of frictional deformation of a chip at the tool-chip contact.
This assumption makes it easy to understand the energy of frictional deformation of chip.

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The navigational, sighting and guidanceinstruments, systems and automations foraeronautical, marine or missile use areadvancing forward to electronics field. The centerof these electronics are gyros, accelerometers, and earth magnetic fluxdetectors, etc.
This paper treats the fundamental research of newly developed measuring sensors of electro-magnatic type and electro-chemical type. This recently developed electronic technics being applied to gyros, accelerometers and earth flux detectors, improves the performance of these instruments and serves to promote automatization and simplicity of navigational, sighting and guidance systems.

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The worked layers produced on (111) surfaces of germanium and silicon by metallographic and optical polishing have been studied with the tracing of polishing processes by mens of micro-etching, interferometry and electron microscopy. The model of distribution of residual stresses is considered to explain the results obtained in te msof the depth and the nature of worked layers on both the surfaces for these two crystals.

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