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36 巻, 429 号
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井上 友一, 大森 正己1970 年 36 巻 429 号 p. 651-656
発行日: 1970年
公開日: 2009/07/23
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深谷 次助, 大石 清1970 年 36 巻 429 号 p. 657-662
発行日: 1970年
公開日: 2009/07/23
ジャーナル フリーThere reported several weighing apparatuses. According to their principle, the counter force against the acting one is caused by the displacement of the force-acting part. But, in the case of measuring the physical quantities, the movement of the sensing part is apt to make a change of initial condition. Then, when the measuring is wanted to be done without displacement of the part, the above method can not be applied.
In order to remedy the above demerit, a device including an integrating element is developed. By inserting the element, the control system becomes to be of so-called I-type, and the steady state deviation of the part can be theoretically removed.
The experiments on the behaviors of this device show good results: the device has no steady state deviation and the controlling system is stable and has quick response. In addition, an applicating experiment to this device to the reaction flow-meter has been done, and the result shows fairly good usefulness of this device.抄録全体を表示PDF形式でダウンロード (936K) -
1970 年 36 巻 429 号 p. 662
発行日: 1970年
公開日: 2009/07/23
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光弾性材料の弾性波伝ぱ速度付近での切削(第1報)山本 明, 中村 示, 神田 元貞1970 年 36 巻 429 号 p. 663-668
発行日: 1970年
公開日: 2009/07/23
ジャーナル フリーPolyurethan resins are cut orthogonally with a tool which is shot out in application of gas expansion, and variations of aspects of stress field induced by increasing cutting speed to the elastic wave propagation speed are observed by means of the dynamic photo-elastic method.
The main results are as followes ;
(1) When increasing cutting speed, the stress acting scope contracts in size and tends to flow away backward, and the compressive stress region ahead of tool edge is constricted to that edge. (2) The tangential force-normal force ratio decreases to some degrees at increasing speed. (3) A shock wave from a tool edge is observed at a cutting speed over distorsion wave propagation speed. Aspects of stress field are similar to that of fluid. (4) The figure of lower order isochromatic lines is somewhat close to the elastic solution of stress field caused by a moving point exerting oblique force with high speed across infinite plate. (5) The distorsion wave speed when it is a half of cutting speed is about fourfold larger than that speed which is calculated from static properties.抄録全体を表示PDF形式でダウンロード (4246K) -
単粒研削における干渉現象(第1報)森 昌幹, 岡本 輝雄1970 年 36 巻 429 号 p. 669-675
発行日: 1970年
公開日: 2009/07/23
ジャーナル フリーSince ground surface is figured by overlapping of numberless grooves cut with individual grains on a grinding wheel, interference action is caused among these grooves reciprocally, while succeeding grains pass through nearby the grooves cut with preceding grains. In this paper, the interference action is studied by analyzing the profile of grooves cut in parallel with pyramidal tool of diamond. The main results are as follows: (1) In the range of pitch ratio γ>4, no interference action is caused, where γ is a ratio of interval between neighboring grooves to their ideal width at the level of the test surface. (2) In the range of γ<4, interference action is caused, i) Height ratio α, a ratio of height of piling-up peak to depth of the grooves, varies according to γ and indicates maximum value in the range of γ≈1.52. ii) Cut-off ratio β, a ratio of actual chip area to the ideal one, increases as γ decreases. iii) The angle of inclination of piling-up peak ψ increases as γ decreases.抄録全体を表示PDF形式でダウンロード (7042K) -
須藤 徹也, 和井 田徹, 佐田 登志夫1970 年 36 巻 429 号 p. 676-682
発行日: 1970年
公開日: 2009/07/23
ジャーナル フリー本研究の結果はっぎのようにまとめられる.
(1) 砥粒切れ刃先端の摩耗面からの反射光による光電出力波形の時間長さから個々の切れ刃の摩耗面長さをインプロセス測定することができた.
(2)研削の進行と,砥石円周方向位置の順番とをあらわすインデックスにより研削過程における個々の砥粒切れ刃の位置をインプロセス測定により登録表示し,電子計算機により,切れ刃挙動のいろいろな実態を知ることができた.
(3)研削に関与する砥粒切れ刃は砥石切り込みが大きいほど数が多く,更新も行なわれ,研削の進行とともに数は増加する.連続切れ刃聞隔分布曲線もこの切れ刃数の変動とよく対応する.
(4)研削中の砥粒切れ刃の脱落または欠損は同一研削条件のもとでは常に一定の割合で起こり,その割合は砥石切り込みや工作物周速度の減少により小さく.
なり,特に砥石周速度の影響を強く受け,高速研削では通常研削速度と比べてかなり小さく,切れ刃寿命は長い.
(5)切れ刃の摩耗面は研削中激しく増減をくり返しており,その変動はかなりランダムで,個々の切れ刃の摩耗面の大きさと切れ刃寿命の関係はすくなく,また研削条件による差もすくない.抄録全体を表示PDF形式でダウンロード (2578K) -
Si単結晶のラッピング機構に関する研究(第2報)池田 正幸1970 年 36 巻 429 号 p. 683-689
発行日: 1970年
公開日: 2009/07/23
ジャーナル フリーIt is widely known that the lapping is necessary to work the brittle materials such as Si single crystal. In this paper, the lapping mechanism of Si crystal is investigated by the aid of measuring the diameter of many grains crushed and analysing the variation of the grain size distribution during lapping. A few types of mechanisms about crushing of grains are discussed. The main results obtained are as follows:
(1) The large grains are crushed in the beginig period of the lapping time. In this period, the lapping is performed by grains acting the rolling motion and lapping removing rate is large. The mean diameter of grains decreases rapidly in this time.
(2) The ratio mean long diameter to mean short diameter of grains crushed is almost constant and its value is about 1.57.
(3) The formula calculating the number of grains is derived by using grain size distribution and the shape model of the abrasive grains proposed. This is the shape combined two hexagonal truncated pyramids in its base plane.
(4) The theoretical formula expressing the variation of the grain size distribution during lapping is obtained.抄録全体を表示PDF形式でダウンロード (3787K) -
レーザによる薄膜加工の研究(第1報)中山 了, 柏原 稔1970 年 36 巻 429 号 p. 690-696
発行日: 1970年
公開日: 2009/07/23
ジャーナル フリーOn micro-machining of thin metal films, the removal mechanism by focused laser beam irradiation and the dimensional appearances of removed holes are discussed analytically with reference to the energy distribution of the beam.
The relations between the beam factors and the hole diameters are represented as the nondimensional formula composed of beam size, beam power and power-threshold for machining. The effects of focal length and defocus distance are also disclosed by the formula.
From the experiments on machining chromium films on glass substrates, it is shown that the formula is applicable to the case of irradiation on focal plane.
The hole diameters are nearly constant regardless of the beam power when the minimum diameters are obtained at the focal plane. The roundness of holes is affected mainly by the radius of resonance mirrors and the beam power irradiated.抄録全体を表示PDF形式でダウンロード (8084K) -
青木 昌治, 多田 邦雄1970 年 36 巻 429 号 p. 697-703
発行日: 1970年
公開日: 2009/07/23
ジャーナル フリーPDF形式でダウンロード (1312K)
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