Journal of the Japan Society of Precision Engineering
Print ISSN : 0374-3543
Volume 39, Issue 457
Displaying 1-14 of 14 articles from this issue
  • [in Japanese]
    1973 Volume 39 Issue 457 Pages 148-154
    Published: February 05, 1973
    Released on J-STAGE: June 30, 2009
    JOURNAL FREE ACCESS
  • [in Japanese]
    1973 Volume 39 Issue 457 Pages 155-165
    Published: February 05, 1973
    Released on J-STAGE: June 30, 2009
    JOURNAL FREE ACCESS
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  • [in Japanese]
    1973 Volume 39 Issue 457 Pages 166-172
    Published: February 05, 1973
    Released on J-STAGE: June 30, 2009
    JOURNAL FREE ACCESS
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  • [in Japanese]
    1973 Volume 39 Issue 457 Pages 173-177
    Published: February 05, 1973
    Released on J-STAGE: June 30, 2009
    JOURNAL FREE ACCESS
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  • [in Japanese]
    1973 Volume 39 Issue 457 Pages 178-185
    Published: February 05, 1973
    Released on J-STAGE: February 16, 2010
    JOURNAL FREE ACCESS
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  • [in Japanese]
    1973 Volume 39 Issue 457 Pages 186-193
    Published: February 05, 1973
    Released on J-STAGE: June 30, 2009
    JOURNAL FREE ACCESS
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  • [in Japanese]
    1973 Volume 39 Issue 457 Pages 194-201
    Published: February 05, 1973
    Released on J-STAGE: June 30, 2009
    JOURNAL FREE ACCESS
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  • [in Japanese]
    1973 Volume 39 Issue 457 Pages 202-206
    Published: February 05, 1973
    Released on J-STAGE: June 30, 2009
    JOURNAL FREE ACCESS
  • Kaoru KINAMARI
    1973 Volume 39 Issue 457 Pages 207-212
    Published: February 05, 1973
    Released on J-STAGE: June 30, 2009
    JOURNAL FREE ACCESS
    As the semiconductor industry continues to progress, photoetching techniques must be improved to meet a new demand which is to engrave complicated patterns less than 2 μm in line-width on thin films. An etched pattern is affected by the photoresist pattern which in turn depends on the density distribution on the photomask. So the relations between the photomask patterns and the sectional shapes of photoresist films are discussed through Γ-characteristic and modulation transfer function in this paper, and the photomask for resolving fine patterns is examined. Consequently, the results obtained are as follows :
    (1) The thickness of the KPR (Kodak Photoresist) film dissolved by developing is related to the exposure by a linear function on a log scale.
    (2) The modulation transfer function of the KPR film including an exposing system is obtained experimentally. For example, the modulation at 250 c/mm is about 0.2.
    (3) The minimum density of photomask determined by line width is required in order to resolve a fine pattern on a photoresist film.
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  • Kiyoshi OISHI, Jisuke FUKAYA, Masabumi KIDO
    1973 Volume 39 Issue 457 Pages 213-218
    Published: February 05, 1973
    Released on J-STAGE: June 30, 2009
    JOURNAL FREE ACCESS
    In a controlling device, it is desired to establish a system that is stable in behavior and has a minor error in a steady state. Theoretically speaking, the steady state error can be removed by constructing the system of 1-type, while in the practical case, because of the existance of frictional resistance, the standstill points of the system are scattered in some zone around the theoretically calculated balancing point. In order to reduce this final state error, it is sometimes tried to increase the open-loop gain of the system, but this method tends to bring the system to be oscillatory.
    For the purpose of overcoming such demerits, it is proposed to construct a system that includes a pulsemotor. By this device the above mentioned two characteristics (final state error and oscillatory behavior) can be made independent of each other and a fairly good controlling result can be expected.
    The experimental result shows that the device is operated well and the expectations can be attained.
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  • Nobuo OHMAE, Tadasu TSUKIZOE
    1973 Volume 39 Issue 457 Pages 219-224
    Published: February 05, 1973
    Released on J-STAGE: June 30, 2009
    JOURNAL FREE ACCESS
    It is most desirable to observe what would happen in fretting process that occurs under conditions of slight oscillatory displacement. The observations of fretting wear were carried out successively under optical microscope, and the behaviour of oxide debris was mainly discussed. The behaviour of oxide debris was influenced by the surface roughness of the specimen, a series of experiments was especially made by using cone indenters with various summit angles. These results clarified the importance to know the easiliness of the discharging oxide debris in real area of contact. The magnitude of the wear damage was strongly dependent upon the amplitude of relative slip, it seems that the oxidative wear plays a principal part in case of an amplitude less than about 70 microns. When experiments were carried out above, these amplitude, the wear damages were excessively severe. It should be reasonable to consider that the mechanical wear overlaps the oxidative one under those conditions. Analyses by X-ray diffraction and reflection election diffraction enlightened a decrease in size of diffraction unit with limited preferred orientation, as would occur when the grains were fragmented by wear process. The observation of wear debris was also made by scanning electron microscope, because it combines the advantage of a large range of viewing directions with a large depth of focus.
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  • Studies on the Thermal Deformations of Workpieces in Surface Grinding (1st Report)
    Yoshikuni NAKANO, Katsuhiko OTA
    1973 Volume 39 Issue 457 Pages 225-229
    Published: February 05, 1973
    Released on J-STAGE: June 30, 2009
    JOURNAL FREE ACCESS
    This paper describes some experiments with the thermal deformations of workpieces, caused by the heat generated in surface grinding, and their influences upon the geometrical accuracies of finished workpieces. The thermal deformations and the temperature distributions of workpieces have been measured directly by using strain gauge type pickups and thermocouples. The straightness of finished workpieces have been measured and compared with the.deformations during grinding. The influences of some parameters on the thermal deformations are investigated. From this study, the following results are obtained. The temperature differences are produced between the top and bottom surfaces of workpieces during grinding operations. Consequently, the workpieces are deformed into convex shape, in addition to the simple expansion in the direction of thickness. As the result, the profiles of finished work-pieces become concave. The cooling effects of grinding fluid are remarkable, but insufficient. The suppressing effects of the electromagnetic chucks and the normal grinding forces on the.thermal deformations are comparatively small.
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  • Effects of the Circulation of Fluids
    Keiji OKUSHIMA, Yoshiaki KAKINO, Toshihiko KIKUCHI
    1973 Volume 39 Issue 457 Pages 230-236
    Published: February 05, 1973
    Released on J-STAGE: June 30, 2009
    JOURNAL FREE ACCESS
    To analyze the effects of the circulation of fluids on the thermal deformations of machine tools, new simulation method is developed, which is based on the finite element method and is added the term of the circulation of fluids. This simulation method is applied to the milling machine, and the calculated values are compared with those measured. From this study the following conclusions are obtained :
    (1) At the case of small circulation rate, the thermal deformations of machine tools with the circulation of fluids are simulated in fairly good accuracy by this method.
    (2) By the circulation of fluids, the bending and torsional deformations of column are prevented, but thermal elongations of column are not decreased as far as the forced cooling is not adapted.
    (3) The artificial cooling of circulating fluids is very effective for decreasing thermal deformations. But, when the heat generation in machine tool is large, the very large cooling ability is needed to decrease those in small level. Therefore, the decreasing of heat generation and the separation of heat sources are required.
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  • [in Japanese], [in Japanese], [in Japanese], [in Japanese]
    1973 Volume 39 Issue 457 Pages 237-238
    Published: February 05, 1973
    Released on J-STAGE: June 30, 2009
    JOURNAL FREE ACCESS
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