Netsu Bussei
Online ISSN : 1881-414X
Print ISSN : 0913-946X
ISSN-L : 0913-946X
Volume 28, Issue 1
Displaying 1-2 of 2 articles from this issue
  • Kosuke Yoshimura, Temujin Uehara, Kan'ei Shinzato, Tatsuya Hisatsugu, ...
    2015 Volume 28 Issue 1 Pages 15-21
    Published: 2015
    Released on J-STAGE: March 12, 2015
    JOURNAL FREE ACCESS
    For the purpose of viscosity measurements of hydrogen at high pressures and high temperatures, a new system with the vibrating wire method that requires only a small amount of sample was developed for the viscosity measurements at low pressures below 1 MPa. The vibrating wire method is the way to supply current to a wire set in the magnetic field and determine the viscosity of the sample fluid by the oscillation of the wire. A curved semi-circle wire made of tungsten and samarium cobalt magnets were adopted in this study. The internal friction coefficient, an important apparatus constant, was measured first at room temperature and 50°C under 1 MPa. Then, the viscosities of nitrogen, helium, and hydrogen were measured under the same conditions.
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  • Tetsuro Ogushi, Satoshi Yanaura, Satoshi Watanabe, Takuya Hirata
    2015 Volume 28 Issue 1 Pages 22-28
    Published: 2015
    Released on J-STAGE: March 12, 2015
    JOURNAL FREE ACCESS
    Thermal characterization of isotropic electrically conductive adhesives (ICAs) is required for thermal management, because the ICAs are applied to die bonding for IC or LED chips. We have been developed steady state comparative-longitudinal heat flow method using cartridge type specimens for thermal conductivity measurement. In present paper, applicable thickness of the specimen and uncertainty of the measurement under effective thermal conductivity of 0.2~50W/m·K of the ICAs were investigated. The results demonstrated that this measurement method could measure the thermal conductivity of specimen within 10% uncertainty under 0.2~70mm thickness range. The effective thermal conductivity of the silver-epoxy conductive adhesive was affected by temperature and an interfacial thermal contact resistance between the adhesive and its adherend.
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