Stress and Strain fields around a tip of a micro slit in an electroplated copper film was analyzed using a finite element method to discuss the development of a method of stress measurement by observing the change of the surface texture of the film under bi-axial stress load. It was found that the principal strain at the slit tip changed sensitively with the change of the load perpendicular to the longitudinal direction of the slit. However, the maximum principal strain did not change when the load was applied parallel to the direction. In addition, when the applied load parallel to the direction was higher than that perpendicular to the direction, the change of the maximum principal strain was not a linear function of the applied stress.

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The Particle-in-Cell/Monte Carlo (PIC/MC) code for 2-dimensional axisymmetrical Cu plasmas is developed and applied to Cu self-sputtering. The electric field is expressed using the Green function in order to dispense with the time-consuming numerical solution of the Poisson equation. Here is clarified the structure of the Cu plasma.

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