The utilization of transient liquid phase bonding has rendered numerous intermetallic compounds (IMCs) employed as die-attach
joints in wide band gap power modules. However, the distinct thermo-mechanical behavior of these IMC joints under thermal
cycling conditions has not been investigated. In this study, a comparative study of the thermo-mechanical behavior of six categories
IMC joints: Ni
3Sn
4, Ag
3Sn, Cu
6Sn
5, Cu
3Sn, Ag
9In
4, and Ag
3In under thermal cycling conditions were studied through finite element
modelling analysis. The thermal stress that induced in IMC joint, and thermal stress/accumulated plastic strain in SiC/direct bonding
copper (DBC) were specifically investigated. The results revealed a clear hierarchy among these IMCs concerning their suitability
for die attachment when considering thermal cycling conditions. Notably, the Ag
3Sn joint emerged as the most promising choice
due to the lowest induced thermal stress within the IMC layer and less damage on SiC/DBC. Conversely, Ni
3Sn
4 exhibits the least
favorable thermos-mechanical behavior among the IMCs.
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