This paper reports the deposition of silicon nitride films on the substrate held at room temperature using 50 Hz plasma CVD with monosilane and nitrogen mixture.
Characteristics of the silicon nitride films deposited on 5 inches Si wafer were as follows. Refractive index of the silicon nitride films was 2.0, and resistivity and breakdown field strength were about 10
15 Ω cm and above 10
6 V/cm, respectively. The distribution of film thickness on 5 inches Si wafer was 1000ű30Å. Fixed charge density and suface state density of Al/SiNx/SiO
2/Si (MNOS) were about 1.5×10
11 cm
-2 and 8×10
10 cm
-2eV
-1, respectively. Substrate temperature dependence of the film properties were also discussed. As high the temperature (<200°C) is, the films become Si rich. However electrical properties were not changed.
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